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Channel characterization for chip-scale wireless communications within computing packages
dc.contributor.author | Timoneda i Comas, Xavier |
dc.contributor.author | Cabellos Aparicio, Alberto |
dc.contributor.author | Manessis, Dionyssios |
dc.contributor.author | Alarcón Cot, Eduardo José |
dc.contributor.author | Abadal Cavallé, Sergi |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2018-12-19T08:50:53Z |
dc.date.available | 2018-12-19T08:50:53Z |
dc.date.issued | 2018 |
dc.identifier.citation | Timoneda, X., Cabellos-Aparicio, A., Manessis, D., Alarcón, E., Abadal, S. Channel characterization for chip-scale wireless communications within computing packages. A: IEEE/ACM International Symposium on Networks-on-Chip. "2018 Twelfth IEEE/ACM International Symposium on Networks-on-Chip (NOCS): Torino, Italy, 4-5 October 2018". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-8. |
dc.identifier.isbn | 978-1-5386-4893-3 |
dc.identifier.uri | http://hdl.handle.net/2117/125964 |
dc.description.abstract | Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses. |
dc.format.extent | 8 p. |
dc.language.iso | eng |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) |
dc.subject | Àrees temàtiques de la UPC::Informàtica::Arquitectura de computadors |
dc.subject.lcsh | Wireless communications systems |
dc.subject.lcsh | Networks on a chip |
dc.subject.other | Channel Characterization |
dc.subject.other | Flip-chip package |
dc.subject.other | Mm-Wave Propagation |
dc.subject.other | Wireless Network-on-Chip |
dc.subject.other | Economic and social effects |
dc.subject.other | Flip chip devices |
dc.subject.other | Microprocessor chips |
dc.subject.other | Microwave antennas |
dc.subject.other | Millimeter waves |
dc.subject.other | Servers |
dc.subject.other | Wireless interconnects |
dc.subject.other | Information transfers |
dc.subject.other | Interchip communications |
dc.subject.other | Millimeter-wave antennas |
dc.subject.other | Package configurations |
dc.subject.other | Transmitter and receiver |
dc.subject.other | Chip scale packages |
dc.title | Channel characterization for chip-scale wireless communications within computing packages |
dc.type | Conference report |
dc.subject.lemac | Comunicació sense fil, Sistemes de |
dc.contributor.group | Universitat Politècnica de Catalunya. CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla |
dc.contributor.group | Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits |
dc.identifier.doi | 10.1109/NOCS.2018.8512172 |
dc.description.peerreviewed | Peer Reviewed |
dc.relation.publisherversion | https://ieeexplore.ieee.org/document/8512172 |
dc.rights.access | Open Access |
local.identifier.drac | 23551311 |
dc.description.version | Postprint (author's final draft) |
dc.relation.projectid | info:eu-repo/grantAgreement/MINECO//PCIN-2015-012/ES/HACIA LAS COMUNICACIONES RF BASADAS EN GRAFENO ? DEMOSTRANDO LAS ANTENAS DE GRAFENO THZ PLASMONICAS./ |
dc.relation.projectid | info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2013-2016/TEC2017-90034-C2-1-R/ES/DISEÑANDO UNA INFRAESTRUCTURA DE RED 5G DEFINIDA MEDIANTE CONOCIMIENTO HACIA LA PROXIMA SOCIEDAD DIGITAL/ |
dc.relation.projectid | info:eu-repo/grantAgreement/EC/H2020/736876/EU/VisorSurf/VISORSURF |
dc.relation.projectid | info:eu-repo/grantAgreement/ICREA/V PRI/ICREA ACADEMIA 2016-02 |
local.citation.author | Timoneda, X.; Cabellos-Aparicio, A.; Manessis, D.; Alarcón, E.; Abadal, S. |
local.citation.contributor | IEEE/ACM International Symposium on Networks-on-Chip |
local.citation.publicationName | 2018 Twelfth IEEE/ACM International Symposium on Networks-on-Chip (NOCS): Torino, Italy, 4-5 October 2018 |
local.citation.startingPage | 1 |
local.citation.endingPage | 8 |