Channel characterization for chip-scale wireless communications within computing packages

View/Open
Cita com:
hdl:2117/125964
Document typeConference report
Defense date2018
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Rights accessOpen Access
European Commission's projectVISORSURF - VisorSurf (EC-H2020-736876)
Abstract
Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses.
CitationTimoneda, X., Cabellos-Aparicio, A., Manessis, D., Alarcón, E., Abadal, S. Channel characterization for chip-scale wireless communications within computing packages. A: IEEE/ACM International Symposium on Networks-on-Chip. "2018 Twelfth IEEE/ACM International Symposium on Networks-on-Chip (NOCS): Torino, Italy, 4-5 October 2018". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-8.
ISBN978-1-5386-4893-3
Publisher versionhttps://ieeexplore.ieee.org/document/8512172
Files | Description | Size | Format | View |
---|---|---|---|---|
Channel Characterization.pdf | 759,1Kb | View/Open |
All rights reserved. This work is protected by the corresponding intellectual and industrial
property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public
communication or transformation of this work are prohibited without permission of the copyright holder