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Electro-thermal coupling analysis methodology for RF circuits
dc.contributor.author | Gómez Salinas, Dídac |
dc.contributor.author | Mateo Peña, Diego |
dc.contributor.author | Altet Sanahujes, Josep |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2010-12-10T13:13:32Z |
dc.date.available | 2010-12-10T13:13:32Z |
dc.date.created | 2010 |
dc.date.issued | 2010 |
dc.identifier.citation | Gómez, D.; Mateo, D.; Altet, J. Electro-thermal coupling analysis methodology for RF circuits. A: 16th International workshop on Thermal investigations of ICs and Systems. "16th THERMINIC". Barcelona: IEEE Computer Society Publications, 2010, p. 154-159. |
dc.identifier.isbn | 978-2-35500-012-6 |
dc.identifier.uri | http://hdl.handle.net/2117/10531 |
dc.description.abstract | In this paper we present an electro-thermal coupling simulation technique for RF circuits. The proposed methodology takes advantage of well established tools for frequency translating circuits in order to significantly reduce the computational resources needed when frequencies of interest are separated by orders of magnitude. |
dc.format.extent | 6 p. |
dc.language.iso | eng |
dc.publisher | IEEE Computer Society Publications |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica |
dc.subject.lcsh | System-on-chip design and technologies |
dc.subject.lcsh | Radio frequency |
dc.subject.lcsh | Electronic engineering |
dc.subject.lcsh | Metal oxide semiconductors, Complementary |
dc.title | Electro-thermal coupling analysis methodology for RF circuits |
dc.type | Conference report |
dc.subject.lemac | Electrònica |
dc.contributor.group | Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
dc.rights.access | Open Access |
local.identifier.drac | 4449039 |
dc.description.version | Postprint (published version) |
local.citation.author | Gómez, D.; Mateo, D.; Altet, J. |
local.citation.contributor | 16th International workshop on Thermal investigations of ICs and Systems |
local.citation.pubplace | Barcelona |
local.citation.publicationName | 16th THERMINIC |
local.citation.startingPage | 154 |
local.citation.endingPage | 159 |