Browsing by Subject "t Cu-in intermetallic compounds"
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Electrodeposition of indium on W and Cu electrodes in the deep eutectic solvent choline chloride-ethylene glycol (1:2) (Elsevier, 2018-08-15)
Open AccessA procedure for drying the deep eutectic solvent (DES) choline chloride - ethylene glycol, ChCl-EG (1:2), based on the use of molecular sieves has been developed, being the final water content of the electrolyte 145±5 ppm. ...