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dc.contributor.authorDomínguez Pumar, Manuel
dc.contributor.authorAtienza García, María Teresa
dc.contributor.authorKowalski, Lukasz
dc.contributor.authorNovio Vázquez, Santiago
dc.contributor.authorGorreta Mariné, Sergio
dc.contributor.authorJiménez Serres, Vicente
dc.contributor.authorSilvestre Bergés, Santiago
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2016-10-13T14:54:21Z
dc.date.available2016-10-13T14:54:21Z
dc.date.issued2016-09-01
dc.identifier.citationDominguez, M., Atienza, M., Kowalski, L., Novio, S., Gorreta, S., Jimenez, V., Silvestre, S. Heat flow dynamics in thermal systems described by diffusive representation. "IEEE transactions on industrial electronics", Vol.64 (1) January 2017
dc.identifier.issn0278-0046
dc.identifier.urihttp://hdl.handle.net/2117/90754
dc.description.abstractThe objective of this paper is to analyze the dynamics of heat flow in thermal structures working under constant temperature operation. This analysis is made using the tools of sliding mode controllers. The theory is developed considering that the thermal system can be described using diffusive representation. The experimental corroboration has been made with a prototype of a wind sensor for Mars atmosphere being controlled by a thermal sigma-delta modulator. This sensor structure allows to analyze experimentally the time-varying case since changes in wind conditions imply changes in the corresponding thermal models. The diffusive symbols of the experimental structures have been obtained from openloop measurements in which pseudo-random binary sequences of heat are injected in the sensor. With the proposed approach it is possible to predict heat flux transient waveforms in systems described by any arbitrary number of poles. This allows for the first time the analysis of lumped and distributed systems without any limitation on the number of poles describing it.
dc.format.extent10 p.
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica
dc.subjectÀrees temàtiques de la UPC::Enginyeria química::Química analítica
dc.subject.lcshIndustrial electronics
dc.subject.lcshThermal analysis
dc.subject.otherFractional order operators
dc.subject.otherDiffusive representation
dc.subject.otherHeat flow
dc.subject.otherThermal anemometry
dc.subject.otherSliding control
dc.titleHeat flow dynamics in thermal systems described by diffusive representation
dc.typeArticle
dc.subject.lemacElectrònica industrial
dc.subject.lemacAnàlisi tèrmica
dc.contributor.groupUniversitat Politècnica de Catalunya. MNT - Grup de Recerca en Micro i Nanotecnologies
dc.identifier.doi10.1109/TIE.2016.2605621
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://ieeexplore.ieee.org/document/7558240/
dc.rights.accessOpen Access
local.identifier.drac19073546
dc.description.versionPostprint (author's final draft)
local.citation.authorDominguez, M.; Atienza, M.; Kowalski, L.; Novio, S.; Gorreta, S.; Jimenez, V.; Silvestre, S.
local.citation.publicationNameIEEE transactions on industrial electronics
local.citation.volume64
local.citation.number99
local.citation.startingPage664
local.citation.endingPage673


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