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9.193 Lectures/texts in conference proceedings
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  • 6th Conference on Trustworthy Manufacturing and Utilization of Secure Devices (TRUDEVICE 2016), Barcelona, 14-16 November, 2016
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  • 6th Conference on Trustworthy Manufacturing and Utilization of Secure Devices (TRUDEVICE 2016), Barcelona, 14-16 November, 2016
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Smart Card Fault Injections with High Temperatures

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hdl:2117/99293

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Massolino, Pedro Maat C.
Ege, Baris
Batina, Lejla
Document typeConference report
Defense date2016-11-15
Rights accessOpen Access
Attribution-NonCommercial-NoDerivs 3.0 Spain
Except where otherwise noted, content on this work is licensed under a Creative Commons license : Attribution-NonCommercial-NoDerivs 3.0 Spain
Abstract
Power and clock glitch attacks on smart cards can help an attacker to discover some internal secrets or bypass certain security checks. Also, an attacker can manipulate the temperature and supply voltage of the device, thus making the device glitch more easily. If these manipulations are within the device operating conditions, it becomes harder to distinguish between an extreme condition from an attacker. To demonstrate temperature and power supply effect on fault attacks, we perform several tests on an Atmega 163 microcontroller in different conditions. Our results show that this kind of attacks are still a serious threat to small devices, whilst maintaining the manufacturer recommendations.
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1: Zona Universitària-Escola T S d'Enginyers, 08028 Barcelona, Espanya
URIhttp://hdl.handle.net/2117/99293
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  • TRUDEVICE - 6th Conference on Trustworthy Manufacturing and Utilization of Secure Devices (TRUDEVICE 2016), Barcelona, 14-16 November, 2016 [43]
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