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dc.contributor.authorGarin Escriva, Moises
dc.contributor.authorHernández García, David
dc.contributor.authorTodorov Trifonov, Trifon
dc.contributor.authorCardador Maza, David
dc.contributor.authorAlcubilla González, Ramón
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2016-05-04T15:59:22Z
dc.date.available2016-05-04T15:59:22Z
dc.date.issued2013
dc.identifier.citationGarin, M., Hernandez, D., Trifonov, T., Cardador, D., Alcubilla, R. Single-Step multiple-layers wafer slicing from macroporous silicon. A: European Photovoltaic Solar Energy Conference and Exhibition. "Proceedings EU PSVSEC 2013, 28th European Photovoltaic Solar Energy Conference and Exhibition, Parc des Expositions Paris Nord Villepinte, Paris, France, Conference 30 Sep - 04 Oct 2013, Exhibition 01 Oct - 03 Oct 2013". Paris Nord Villepinte: 2013, p. 933-936.
dc.identifier.isbn3-936338-33-7
dc.identifier.urihttp://hdl.handle.net/2117/86600
dc.description.abstractThere is a rising interest, from both photovoltaics and microelectronics industry, in wafer thickness reduction. During the last decade, it has been steadily reduced from 350 µm to 180 µm, but benefits are foreseen for thicknesses well below these values. The current sawing technology, however, suffers from large kerf losses and further reductions are increasingly difficult. Several technologies have emerged aiming to produce thin Si foils from a wafer, such as layer transfer, induced cleaving, or pore reorganization. These methods produce a single layer by step. In this work we report on a method able to produce many crystalline layers from a single silicon wafer and in a single fabrication step.
dc.format.extent4 p.
dc.language.isoeng
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Energies::Energia solar fotovoltaica::Cèl·lules solars
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica
dc.subject.lcshSolar cells
dc.subject.lcshSilicon
dc.subject.otherCrystallisation
dc.subject.otherSilicon-Films
dc.subject.otherThin Film Solar Cell
dc.subject.otherWafering
dc.titleSingle-Step multiple-layers wafer slicing from macroporous silicon
dc.typeConference report
dc.subject.lemacSilici -- Propietats òtiques
dc.subject.lemacBateries solars
dc.subject.lemacCèl·lules solars
dc.contributor.groupUniversitat Politècnica de Catalunya. MNT - Grup de Recerca en Micro i Nanotecnologies
dc.identifier.doi10.4229/28thEUPVSEC2013-2CO.2.5
dc.rights.accessOpen Access
local.identifier.drac12987832
dc.description.versionPostprint (published version)
local.citation.authorGarin, M.; Hernandez, D.; Trifonov, T.; Cardador, D.; Alcubilla, R.
local.citation.contributorEuropean Photovoltaic Solar Energy Conference and Exhibition
local.citation.pubplaceParis Nord Villepinte
local.citation.publicationNameProceedings EU PSVSEC 2013, 28th European Photovoltaic Solar Energy Conference and Exhibition, Parc des Expositions Paris Nord Villepinte, Paris, France, Conference 30 Sep - 04 Oct 2013, Exhibition 01 Oct - 03 Oct 2013
local.citation.startingPage933
local.citation.endingPage936


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