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The low area probing detector as a countermeasure against invasive attacks
(2017-11-07)
Article
Open AccessMicroprobing allows intercepting data from on-chip wires as well as injecting faults into data or control lines. This makes it a commonly used attack technique against security-related semiconductors, such as smart card ... -
RRAM serial configuration for the generation of random bits
(2017-06-25)
Article
Restricted access - publisher's policy -
Defending cache memory against cold-boot attacks boosted by power or EM radiation analysis
(2017-04)
Article
Restricted access - publisher's policySome algorithms running with compromised data select cache memory as a type of secure memory where data is confined and not transferred to main memory. However, cold-boot attacks that target cache memories exploit the data ... -
Multi-directional space tessellation to improve the decision boundary in indirect mixed-signal testing
(2017-02-20)
Article
Restricted access - publisher's policyOne of the most challenging aspects in nowadays microelectronics industry is production test and verification of mixed-signal circuits. In order to cope with some of the drawbacks encountered in this scenario, researchers ... -
Indirect test of M-S circuits using multiple specification band guarding
(2016-09-01)
Article
Restricted access - publisher's policyTesting analog and mixed-signal circuits is a costly task due to the required test time targets and high end technical resources. Indirect testing methods partially address these issues providing an efficient solution using ... -
Test escapes of stuck-open faults caused by parasitic capacitances and leakage currents
(2015-09-24)
Article
Open AccessIntragate open defects are responsible for a significant percentage of defects in present technologies. A majority of these defects causes the logic gate to become stuck open, and this is why they are traditionally modeled ... -
Efficient production binning using octree tessellation in the alternate measurements space
(2015)
Article
Open AccessBinning after volume production is a widely accepted technique to classify fabricated ICs into different clusters depending on different degrees of specification compliance. This allows the manufacturer to sell non optimal ... -
Prebond testing of weak defects in TSVs
(2015-08-07)
Article
Restricted access - publisher's policyThrough-silicon vias (TSVs) are critical elements in 3-D integrated circuits susceptible to defects during fabrication and lifetime. It is desirable to detect defective TSVs in the early steps of the fabrication process ...
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