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DC temperature measurements to characterize the central frequency and 3 dB bandwidth in mmW power amplifiers
dc.contributor.author | Aragonès Cervera, Xavier |
dc.contributor.author | Mateo Peña, Diego |
dc.contributor.author | González Jiménez, José Luis |
dc.contributor.author | Vidal López, Eva María |
dc.contributor.author | Gómez Salinas, Didac |
dc.contributor.author | Martineau, B |
dc.contributor.author | Altet Sanahujes, Josep |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2015-11-13T14:55:10Z |
dc.date.available | 2015-11-13T14:55:10Z |
dc.date.issued | 2015-11 |
dc.identifier.citation | Aragones, X., Mateo, D., González, J.L., Vidal, E., Gómez, D., Martineau, B., Altet, J. DC temperature measurements to characterize the central frequency and 3 dB bandwidth in mmW power amplifiers. "IEEE microwave and wireless components letters", Novembre 2015, vol. 25, núm. 11, p. 745-747. |
dc.identifier.issn | 1531-1309 |
dc.identifier.uri | http://hdl.handle.net/2117/79249 |
dc.description.abstract | This letter shows how a temperature sensor and a simple DC voltage multimeter can be used as instruments to determine the central frequency and 3 dB bandwidth of a 60 GHz linear power amplifier (PA). Compared to previous works, the DC temperature monitoring now proposed requires a much simpler and convenient measurement set-up. In this example, the temperature sensor is embedded in the same silicon die as the PA. Being placed in empty layout spaces next to it, it is proposed as a built-in test circuit. |
dc.format.extent | 3 p. |
dc.language.iso | eng |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es/ |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica::Instrumentació i mesura |
dc.subject.lcsh | Integrated circuits |
dc.subject.lcsh | Temperature measurements |
dc.subject.other | Built-in test |
dc.subject.other | CMOS millimeter wave integrated circuits |
dc.subject.other | Design for testability |
dc.subject.other | Temperature measurement |
dc.title | DC temperature measurements to characterize the central frequency and 3 dB bandwidth in mmW power amplifiers |
dc.type | Article |
dc.subject.lemac | Circuits integrats |
dc.subject.lemac | Termometria |
dc.contributor.group | Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
dc.contributor.group | Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits |
dc.identifier.doi | 10.1109/LMWC.2015.2479848 |
dc.description.peerreviewed | Peer Reviewed |
dc.relation.publisherversion | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7293238&filter%3DAND%28p_IS_Number%3A7317830%29 |
dc.rights.access | Open Access |
local.identifier.drac | 17230898 |
dc.description.version | Postprint (author's final draft) |
dc.relation.projectid | info:eu-repo/grantAgreement/MINECO//TEC2013-45638-C3-2-R/ES/APROXIMACION MULTINIVEL AL DISEÑO ORIENTADO A LA FIABILIDAD DE CIRCUITOS INTEGRADOS ANALOGICOS Y DIGITALES/ |
local.citation.author | Aragones, X.; Mateo, D.; González, J.L.; Vidal, E.; Gómez, D.; Martineau, B.; Altet, J. |
local.citation.publicationName | IEEE microwave and wireless components letters |
local.citation.volume | 25 |
local.citation.number | 11 |
local.citation.startingPage | 745 |
local.citation.endingPage | 747 |
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