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Diseño y fabricación de líneas de retardo en LTCC

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hdl:2117/78920

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Benet Colom, Pablo
Tutor / directorAragonès Cervera, XavierMés informacióMés informacióMés informació; Sieiro Córdoba, Javier José
CovenanteeFrancisco Albero
Document typeMaster thesis
Date2015-10-28
Rights accessOpen Access
Attribution-NonCommercial-NoDerivs 3.0 Spain
This work is protected by the corresponding intellectual and industrial property rights. Except where otherwise noted, its contents are licensed under a Creative Commons license : Attribution-NonCommercial-NoDerivs 3.0 Spain
Abstract
In this master's Thesis, a new structure of differential delay line in LTCC was designed, exploiting the benefits that offer this technology for telecommunications and the stacking capability of multiple layers, which let us design in 3D. This structure was simulated, manufactured and mesured. It was compared with other typical structures in PCBs like coupled lines, meander lines and braided lines. The final result was a passive integrated component with a notably lower size than the common designs.
 
En esta tesina se plantean una nueva estructura para realizar líneas de retardo diferenciales en LTCC, aprovechando las prestaciones que ofrece esta tecnología para aplicaciones en telecomunicaciones y su capacidad de superponer múltiples capas, lo cuál nos permite plantear diseños en 3D. Esta estructura ha sido simulada, fabricada y medida. Se ha comparado estructuras típicas que se realizan en PCBs actualmente, como son líneas trenzadas, meandros y líneas simples con el nuevo diseño de línea de retardo 3D. El resultado ha sido un componente pasivo integrado de dimensiones notablemente inferiores a los que se puedan generar en los diseños típicos.
SubjectsLow Temperature Cofired Ceramic technology, Tecnologia ceràmica multicapa sinteritzada a baixa temperatura
URIhttp://hdl.handle.net/2117/78920
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