A review on low-cost sensors compatible with open-source platforms used for life-cycle monitoring of civil structures
Document typeConference report
Rights accessOpen Access
ProjectMODELOS ESTRUCTURALES PARA LA GESTION EFICIENTE DE INFRAESTRUCTURAS: SMART BIM MODELS (AEI-BIA2017-86811-C2-1-R)
Lately, the need for adopting sensors in buildings and infrastructures for monitoring and inspection of the health state of those structures is increasing. This demand is due to the increasing age of the structural stock worldwide. Consequently, more economical ways of Structural Health Monitoring applications are getting huge attention. This paper presents and evaluates several low-cost electronics compatible with open-source digital technologies for static and dynamic Structural System Identification applications. Firstly, an open-source microcontroller (Arduino), the main programable logic controller, and a Raspberry pi, a small single-board computer, are introduced. Secondly, various economic sensors with diverse measurement applications, such as ultrasonic and laser ranging, acceleration, temperature, and humidity, are discussed. Thirdly, multiple experiments in different controlled ambients are applied to assess and compare their tolerances as well as advantages and disadvantages of their use, among their price. Some problems with the Arduino codes and sensor positions emerged during the installation of the sensors and the data collection process. Finally, to attain an effective manner of using these low-cost electronics, this article offers answers to the issues faced.
CitationKomarizadehasl, S. [et al.]. A review on low-cost sensors compatible with open-source platforms used for life-cycle monitoring of civil structures. A: International Symposium on Life-Cycle Civil Engineering. "Life-Cycle of Structures and Infrastructure Systems: Proceedings of the Eighth International Symposium on Life-Cycle Civil Engineering (IALCCE 2023), 2-6 July, 2023, Politecnico di Milano, Milan, Italy". 2023, p. 1-8. ISBN 978-1-003-32302-0. DOI 10.1201/9781003323020-207.