| dc.contributor.author | Azpúrua Auyanet, Marco Aurelio |
| dc.contributor.author | Mateu Mateus, Marc |
| dc.contributor.author | Pous Solà, Marc |
| dc.contributor.author | Quílez Figuerola, Marcos |
| dc.contributor.author | Silva Martínez, Fernando |
| dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
| dc.date.accessioned | 2022-12-23T12:26:32Z |
| dc.date.available | 2022-12-23T12:26:32Z |
| dc.date.issued | 2022 |
| dc.identifier.citation | Azpurua, M.A. [et al.]. Broadband effective dielectric permittivity of heterogeneous 3D printed PLA structures. A: International Symposium on Electromagnetic Compatibility. "2022 International Symposium on Electromagnetic Compatibility: EMC Europe: Gothenburg: Sweden: September 5-8, 2022: proceedings". Institute of Electrical and Electronics Engineers (IEEE), 2022, p. 1-5. ISBN 978-1-6654-0787-8. DOI 10.1109/EMCEurope51680.2022.9901111. |
| dc.identifier.isbn | 978-1-6654-0787-8 |
| dc.identifier.uri | http://hdl.handle.net/2117/379427 |
| dc.description | © 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
| dc.description.abstract | 3D printing and additive manufacturing technologies are increasingly being employed for electronics, RF, and microwave applications because they allow high design flexibility at low cost and rapid prototyping. The intrinsic heterogeneity of printed parts has become a challenge from an electromagnetic compatibility standpoint due to their unknown impact on the electromagnetic behavior of such prototypes. To estimate relevant EMC characteristics, such as the shielding effectiveness, characteristic impedance, and coupling effects it is fundamental to know the effective dielectric permittivity of such heterogeneous structures. In this paper, the dielectric permittivity of 3D printed PLA structures is measured using the stepwise Nicolson-Ross-Weir method in the 1 GHz – 6 GHz frequency range. The influence of the layer thickness and the infill percentage is investigated. |
| dc.description.sponsorship | This work was supported by the Spanish
“Agencia Estatal de Investigacion” under project ´
PID2019-106120RB-C31/AEI/10.13039/501100011033. |
| dc.format.extent | 5 p. |
| dc.language.iso | eng |
| dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica::Instrumentació i mesura::Compatibilitat electromagnètica |
| dc.subject.lcsh | Electromagnetic compatibility |
| dc.subject.lcsh | Numerical analysis |
| dc.subject.other | 3-D printing |
| dc.subject.other | Dielectric constant |
| dc.subject.other | Effective permittivity |
| dc.subject.other | Heterogeneous structure |
| dc.subject.other | PLA material |
| dc.title | Broadband effective dielectric permittivity of heterogeneous 3D printed PLA structures |
| dc.type | Conference report |
| dc.subject.lemac | Compatibilitat electromagnètica |
| dc.subject.lemac | Anàlisi numèrica |
| dc.contributor.group | Universitat Politècnica de Catalunya. ISI - Grup d'Instrumentació, Sensors i Interfícies |
| dc.contributor.group | Universitat Politècnica de Catalunya. IEB - Instrumentació Electrònica i Biomèdica |
| dc.identifier.doi | 10.1109/EMCEurope51680.2022.9901111 |
| dc.description.peerreviewed | Peer Reviewed |
| dc.relation.publisherversion | https://ieeexplore.ieee.org/document/9901111 |
| dc.rights.access | Open Access |
| local.identifier.drac | 34313507 |
| dc.description.version | Postprint (author's final draft) |
| dc.relation.projectid | info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2019-106120RB-C31/ES/METODOS DE MEDIDA DE INTERFERENCIA ELECTROMAGNETICA EN VEHICULOS AEREOS NO TRIPULADOS CON FUSELAJES INTELIGENTES/ |
| local.citation.author | Azpurua, M. A.; Mateu, M.; Pous, M.; Quilez, M.; Silva, F. |
| local.citation.contributor | International Symposium on Electromagnetic Compatibility |
| local.citation.publicationName | 2022 International Symposium on Electromagnetic Compatibility: EMC Europe: Gothenburg: Sweden: September 5-8, 2022: proceedings |
| local.citation.startingPage | 1 |
| local.citation.endingPage | 5 |
