ecoHMEM: Improving object placement methodology for hybrid memory systems in HPC
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hdl:2117/375994
Document typeConference report
Defense date2022
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Rights accessOpen Access
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ProjectECO-H-MEM - Advanced Ecosystem for Broad Heterogeneous Memory Usage (EC-H2020-749516)
EPEEC - European joint Effort toward a Highly Productive Programming Environment for Heterogeneous Exascale Computing (EPEEC) (EC-H2020-801051)
DEEP-SEA - DEEP – SOFTWARE FOR EXASCALE ARCHITECTURES (EC-H2020-955606)
BSC - COMPUTACION DE ALTAS PRESTACIONES VIII (AEI-PID2019-107255GB-C21)
EPEEC - European joint Effort toward a Highly Productive Programming Environment for Heterogeneous Exascale Computing (EPEEC) (EC-H2020-801051)
DEEP-SEA - DEEP – SOFTWARE FOR EXASCALE ARCHITECTURES (EC-H2020-955606)
BSC - COMPUTACION DE ALTAS PRESTACIONES VIII (AEI-PID2019-107255GB-C21)
Abstract
Recent byte-addressable persistent memory (PMEM) technology offers capacities comparable to storage devices and access times much closer to DRAMs than other non-volatile memory technology. To palliate the large gap with DRAM performance, DRAM and PMEM are usually combined. Users have the choice to either manage the placement to different memory spaces by software or leverage the DRAM as a cache for the virtual address space of the PMEM. We present novel methodology for automatic object-level placement, including efficient runtime object matching and bandwidth-aware placement. Our experiments leveraging Intel® Optane™ Persistent Memory show from matching to greatly improved performance with respect to state-of-the-art software and hardware solutions, attaining over 2x runtime improvement in miniapplications and over 6% in OpenFOAM, a complex production application.
CitationJorda, M. [et al.]. ecoHMEM: Improving object placement methodology for hybrid memory systems in HPC. A: IEEE International Conference on Cluster Computing. "2022 IEEE International Conference on Cluster Computing, Cluster 2022: Heidelberg, Germany, 6-9 September 2022: proceedings". Institute of Electrical and Electronics Engineers (IEEE), 2022, p. 278-288. ISBN 978-1-6654-9856-2. DOI 10.1109/CLUSTER51413.2022.00040.
ISBN978-1-6654-9856-2
Publisher versionhttps://ieeexplore.ieee.org/document/9912666
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