Frequency characterization of a 2.4 GHz CMOS LNA by Thermal Measurements

Mateo Peña, Diego; Altet Sanahujes, Josep; Aldrete Vidrio, Héctor; González Jiménez, José Luis

doi:10.1109/RFIC.2006.1651204

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Mateo Peña, Diego

Altet Sanahujes, Josep

Aldrete Vidrio, Héctor

González Jiménez, José Luis

Document typeConference report

Defense date2006

PublisherInstitute of Electrical and Electronics Engineers (IEEE)

Rights accessOpen Access

All rights reserved. This work is protected by the corresponding intellectual and industrial property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public communication or transformation of this work are prohibited without permission of the copyright holder

Abstract

This paper presents a technique to obtain electrical characteristics of analog and RF circuits, based on measuring temperature at the silicon surface close to the circuit under test. Experimental results validate the feasibility of the technique. Simulated results show how this technique can be used to measure the bandwidth and central frequency of a 2.4 GHz low noise amplifier (LNA) designed in a 0.35 microns standard CMOS technology.

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© 2006 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

CitationMateo, D. [et al.]. Frequency characterization of a 2.4 GHz CMOS LNA by Thermal Measurements. A: IEEE Radio Frequency Integrated Circuits Symposium. "2006 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium: June 10-13, 2006: digest of papers". Institute of Electrical and Electronics Engineers (IEEE), 2006, p. 565-568. ISBN 0-7803-9572-7. DOI 10.1109/RFIC.2006.1651204.

URIhttp://hdl.handle.net/2117/373800

DOI10.1109/RFIC.2006.1651204

ISBN0-7803-9572-7

Publisher versionhttps://ieeexplore.ieee.org/document/1651204

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