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ETS 2022 Foreword

dc.contributor.authorManich Bou, Salvador
dc.contributor.authorRodríguez, Rosa
dc.contributor.authorMir, Salvador
dc.contributor.authorBernardi, Paolo
dc.contributor.authorTille, Daniel
dc.contributor.authorBosio, Alberto
dc.date.accessioned2022-07-08T08:00:20Z
dc.date.available2022-09-01T10:59:38Z
dc.date.issued2022-05
dc.identifier.citationManich Bou, S. [et al.]. ETS 2022 Foreword. A: 27th IEEE European Test Symposium (ETS). 2022,
dc.identifier.urihttp://hdl.handle.net/2117/372187
dc.language.isoeng
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica
dc.subject.lcshMicroelectronics
dc.subject.lcshIntegrated circuits
dc.subject.lcshSpintronics
dc.titleETS 2022 Foreword
dc.typeConference report
dc.subject.lemacMicroelectrònica
dc.subject.lemacCircuits integrats
dc.subject.lemacEspintrònica
dc.rights.accessOpen Access
local.citation.contributor27th IEEE European Test Symposium (ETS)


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