PFS - Manufacturing Testing and Functional Safety techniques for Automotive SoCs

Abstract

Technology improvements, different integration technologies, increased heterogeneity, and many embedded memories contribute to System On Chip’s rising complexity (SoC), transforming high-volume manufacturing tests in the semiconductor industry targeting safety-critical products. Besides those improvements, traditional structural test methods, such as scan and BIST, can cover a vast but not complete spectrum of all possible physical defects. In the last years, many companies have introduced System-Level Test as the final test step, which represents as close as possible the final environment. This new final test type aims to fill uncovered leftover gaps of structural tests, e.g., components interactions and communication peripherals. Moreover, following this introduction of a new type of final test step, it arises new problems during the previous phase, such as Burn-In. During this phase, new methodologies for stimulating components’ interactions capabilities must be carefully selected.