Thermal comfort improvement by applying parametric design panel as a second skin on the facade in building refurbishment in moderate climate
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Document typeConference report
Defense date2021
PublisherAssociation for Computing Machinery (ACM)
Rights accessRestricted access - publisher's policy
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Abstract
Facade design has an important effect on thermal comfort for building occupants. The design of the second shell of the facade, in addition to visual beauty, modifies the environmental conditions for the residents inside the building. Views designed according to the parametric design can provide thermal comfort for the residents by increasing the function of daylight, heating, and cooling in residential spaces. Daylight analysis will be performed using Grasshopper and optimization for buildings in temperate and humid climates. This thesis presents a parametric design in architecture practice and puts the focus on its applications in thermal comfort, which can have an essential impact on improving energy saving.
CitationYazdibahri, S.; Alier, M.; Sánchez Riera, A. Thermal comfort improvement by applying parametric design panel as a second skin on the facade in building refurbishment in moderate climate. A: International Conference on Technological Ecosystem for Enhancing Multiculturality. "TEEM'21: Ninth International Conference on Technological Ecosystems for Enhancing Multiculturality: Barcelona, Spain, October 27th-29th, 2021". New York: Association for Computing Machinery (ACM), 2021, p. 763-767. ISBN 978-1-4503-9066-8. DOI 10.1145/3486011.3486535.
ISBN978-1-4503-9066-8
Publisher versionhttps://dl.acm.org/doi/10.1145/3486011.3486535
Collections
- Doctorat en Sostenibilitat - Ponències/Comunicacions de congressos [30]
- ADR&M - Arquitectura, Disseny: Representació i Modelatge - Ponències/Comunicacions de congressos [85]
- BCN SEER - Barcelona Science and Engineering Education Research Group - Ponències/Comunicacions de congressos [53]
- Departament de Representació Arquitectònica - Ponències/Comunicacions de congressos [71]
- Departament d'Enginyeria de Serveis i Sistemes d'Informació - Ponències/Comunicacions de congressos [485]
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