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Stress effects of silica particles in a semiconductor package molding compound
| dc.contributor.author | Font Martínez, Francesc |
| dc.contributor.other | Universitat Politècnica de Catalunya. Departament de Mecànica de Fluids |
| dc.date.accessioned | 2021-12-02T12:38:46Z |
| dc.date.available | 2021-12-02T12:38:46Z |
| dc.date.issued | 2015-07-03 |
| dc.identifier.citation | Font, F. Stress effects of silica particles in a semiconductor package molding compound. 2015. |
| dc.identifier.other | https://eprints.lancs.ac.uk/id/eprint/78954/1/Analog15.pdf |
| dc.identifier.uri | http://hdl.handle.net/2117/357673 |
| dc.description.abstract | The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane. |
| dc.language.iso | eng |
| dc.rights | Attribution-NonCommercial-NoDerivs 3.0 Spain |
| dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es/ |
| dc.subject | Àrees temàtiques de la UPC::Matemàtiques i estadística |
| dc.title | Stress effects of silica particles in a semiconductor package molding compound |
| dc.type | External research report |
| dc.contributor.group | Universitat Politècnica de Catalunya. GReCEF- Grup de Recerca en Ciència i Enginyeria de Fluids |
| dc.rights.access | Open Access |
| local.identifier.drac | 32208882 |
| dc.description.version | Preprint |
| local.citation.author | Font, F. |
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