Dataflow-architecture co-design for 2.5D DNN accelerators using wireless network-on-package
Document typeConference report
PublisherAssociation for Computing Machinery (ACM)
Rights accessOpen Access
European Commission's projectWiPLASH - Architecting More Than Moore – Wireless Plasticity for Heterogeneous Massive Computer Architectures (EC-H2020-863337)
Deep neural network (DNN) models continue to grow in size and complexity, demanding higher computational power to enable real-time inference. To efficiently deliver such computational demands, hardware accelerators are being developed and deployed across scales. This naturally requires an efficient scale-out mechanism for increasing compute density as required by the application. 2.5D integration over interposer has emerged as a promising solution, but as we show in this work, the limited interposer bandwidth and multiple hops in the Network-on-Package (NoP) can diminish the benefits of the approach. To cope with this challenge, we propose WIENNA, a wireless NoP-based 2.5D DNN accelerator. In WIENNA, the wireless NoP connects an array of DNN accelerator chiplets to the global buffer chiplet, providing high-bandwidth multicasting capabilities. Here, we also identify the dataflow style that most efficienty exploits the wireless NoP's high-bandwidth multicasting capability on each layer. With modest area and power overheads, WIENNA achieves 2.2X-5.1X higher throughput and 38.2% lower energy than an interposer-based NoP design.
CitationGuirado, R. [et al.]. Dataflow-architecture co-design for 2.5D DNN accelerators using wireless network-on-package. A: Asia and South Pacific Design Automation Conference. "ASPDAC '21: Proceedings of the 26th Asia and South Pacific Design Automation Conference". New York: Association for Computing Machinery (ACM), 2021, p. 806-812. ISBN 978-1-4503-7999-1. DOI 10.1145/3394885.3431537.
- CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla - Ponències/Comunicacions de congressos 
- EPIC - Energy Processing and Integrated Circuits - Ponències/Comunicacions de congressos 
- Departament d'Arquitectura de Computadors - Ponències/Comunicacions de congressos [1.656]
- Departament d'Enginyeria Electrònica - Ponències/Comunicacions de congressos [1.512]
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