Graphene-enabled wireless communication for massive multicore architectures
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European Commisision's projectINTEGRADE - Integrating Graphene Devices (EC-FP7-307311)
HIPEAC - High Performance and Embedded Architecture and Compilation (EC-FP7-287759)
GRADE - Graphene-based Devices and Circuits for RF Applications (EC-FP7-317839)
Current trends in microprocessor architecture design are leading towards a dramatic increase of core-level parallelization, wherein a given number of independent processors or cores are interconnected. Since the main bottleneck is foreseen to migrate from computation to communication, efficient and scalable means of inter-core communication are crucial for guaranteeing steady performance improvements in many-core processors. As the number of cores grows, it remains unclear whether initial proposals, such as the Network-on-Chip (NoC) paradigm, will meet the stringent requirements of this scenario. This position paper presents a new research area where massive multicore architectures have wireless communication capabilities at the core level. This goal is feasible by using graphene-based planar antennas, which can radiate signals at the Terahertz band while utilizing lower chip area than its metallic counterparts. To the best of our knowledge, this is the first work that discusses the utilization of graphene-enabled wireless communication for massive multicore processors. Such wireless systems enable broadcasting, multicasting, all-to-all communication, as well as significantly reduce many of the issues present in massively multicore environments, such as data coherency, consistency, synchronization and communication problems. Several open research challenges are pointed out related to implementation, communications and multicore architectures, which pave the way for future research in this multidisciplinary area.
CitationAbadal, S. [et al.]. Graphene-enabled wireless communication for massive multicore architectures. "IEEE communications magazine", 11 Novembre 2013, vol. 51, núm. 11, p. 137-143.
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