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dc.contributor.authorSolinas, Marco
dc.contributor.authorBadia Sala, Rosa Maria
dc.contributor.authorBodin, François
dc.contributor.authorCohen, Albert
dc.contributor.authorEvripidou, Paraskevas
dc.contributor.authorFaraboschi, Paolo
dc.contributor.authorFechner, Bernhard
dc.contributor.authorGao, Guang R.
dc.contributor.authorGarbade, Arne
dc.contributor.authorGirbal, Sylvain
dc.contributor.authorGoodman, Daniel
dc.contributor.authorKhan, Behran
dc.contributor.authorKoliai, Souad
dc.contributor.authorLi, Feng
dc.contributor.authorLujan, Mikel
dc.contributor.authorMorin, Laurent
dc.contributor.authorMendelson, Avi
dc.contributor.authorNavarro, Nacho
dc.contributor.authorPop, Antoniu
dc.contributor.authorTrancoso, Pedro
dc.contributor.authorUngerer, Theo
dc.contributor.authorValero Cortés, Mateo
dc.contributor.authorWeis, Sebastian
dc.contributor.authorWatson, Ian
dc.contributor.authorZuckermann, Stéphane
dc.contributor.authorGiorgi, Roberto
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
dc.date.accessioned2015-04-14T08:41:18Z
dc.date.created2013
dc.date.issued2013
dc.identifier.citationSolinas, M. [et al.]. The TERAFLUX Project: Exploiting the dataflow paradigm in next generation teradevices. A: Euromicro Symposium on Digital Systems Design. "16th Euromicro Conference on Digital System Design, DSD 2013: 4-6 September 2013, Santander, Spain: proceedings". Santander: IEEE Computational Intelligence Society, 2013, p. 272-279.
dc.identifier.isbn978-0-7695-5074-9
dc.identifier.urihttp://hdl.handle.net/2117/27302
dc.description.abstractThanks to the improvements in semiconductor technologies, extreme-scale systems such as teradevices (i.e., composed by 1000 billion of transistors) will enable systems with 1000+ general purpose cores per chip, probably by 2020. Three major challenges have been identified: programmability, manageable architecture design, and reliability. TERAFLUX is a Future and Emerging Technology (FET) large-scale project funded by the European Union, which addresses such challenges at once by leveraging the dataflow principles. This paper describes the project and provides an overview of the research carried out by the TERAFLUX consortium.
dc.format.extent8 p.
dc.language.isoeng
dc.publisherIEEE Computational Intelligence Society
dc.subjectÀrees temàtiques de la UPC::Informàtica::Arquitectura de computadors
dc.subject.lcshHigh performance computing
dc.subject.otherTERAFLUX
dc.subject.otherDataflow
dc.subject.otherProgramming model
dc.subject.otherCompilation
dc.subject.otherReliability
dc.subject.otherArchitecture
dc.subject.otherSimulation
dc.subject.otherMany-cores
dc.subject.otherExascale computing
dc.subject.otherMulti-cores
dc.titleThe TERAFLUX Project: Exploiting the dataflow paradigm in next generation teradevices
dc.typeConference report
dc.subject.lemacCàlcul intensiu (Informàtica)
dc.contributor.groupUniversitat Politècnica de Catalunya. CAP - Grup de Computació d'Altes Prestacions
dc.identifier.doi10.1109/DSD.2013.39
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6628287
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac15112488
dc.description.versionPostprint (published version)
dc.relation.projectidinfo:eu-repo/grantAgreement/EC/FP7/249013/EU/Exploiting dataflow parallelism in Teradevice Computing/TERAFLUX
dc.date.lift10000-01-01
local.citation.authorSolinas, M.; Badia, R.M.; Bodin, F.; Cohen, A.; Evripidou, P.; Faraboschi, P.; Fechner, B.; Gao, G.; Garbade, A.; Girbal, S.; Goodman, D.; Khan, B.; Koliai, S.; Li, F.; Lujan, M.; Morin, L.; Mendelson, A.; Navarro, Nacho; Pop, A.; Trancoso, P.; Ungerer, T.; Valero, M.; Weis, S.; Watson, I.; Zuckermann, S.; Giorgi, R.
local.citation.contributorEuromicro Symposium on Digital Systems Design
local.citation.pubplaceSantander
local.citation.publicationName16th Euromicro Conference on Digital System Design, DSD 2013: 4-6 September 2013, Santander, Spain: proceedings
local.citation.startingPage272
local.citation.endingPage279


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