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Self-assembly of ordered silica nanostructures by electrospray

dc.contributor.authorColl Valentí, Arnau
dc.contributor.authorBermejo Broto, Sandra
dc.contributor.authorCastañer Muñoz, Luis María
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2014-11-19T15:23:23Z
dc.date.created2014-06-01
dc.date.issued2014-06-01
dc.identifier.citationColl, A.; Bermejo, S.; Castañer, L. Self-assembly of ordered silica nanostructures by electrospray. "Microelectronic engineering", 01 Juny 2014, vol. 121, p. 68-71.
dc.identifier.issn0167-9317
dc.identifier.urihttp://hdl.handle.net/2117/24768
dc.description.abstractIn this paper we introduce the electrospray technique as a suitable method to create SiO2 3D ordered nanostructures. We describe the experimental procedure and deposition parameters required. We have found that the use of a high electric field is mandatory to, first, induce the Taylor cone and then, to get 3D order while the nanospheres assemble in the substrate in the drying phase. (C) 2014 Elsevier B.V. All rights reserved.
dc.format.extent4 p.
dc.language.isoeng
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica
dc.subject.lcshElectronics
dc.subject.lcshMicrotechnology
dc.subject.otherNanoparticles
dc.subject.otherColloidal crystals
dc.subject.otherElectrospray
dc.subject.otherPolystyrene
dc.subject.otherSilica
dc.subject.otherCOLLOIDAL CRYSTALS
dc.subject.otherDEPOSITION
dc.subject.otherFILMS
dc.titleSelf-assembly of ordered silica nanostructures by electrospray
dc.typeArticle
dc.subject.lemacNanociència
dc.subject.lemacMicrotecnologia
dc.contributor.groupUniversitat Politècnica de Catalunya. MNT - Grup de Recerca en Micro i Nanotecnologies
dc.identifier.doi10.1016/j.mee.2014.03.031
dc.relation.publisherversionhttp://www.sciencedirect.com/science/article/pii/S0167931714001257#
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac14137068
dc.description.versionPostprint (published version)
dc.date.lift10000-01-01
local.citation.authorColl, A.; Bermejo, S.; Castañer, L.
local.citation.publicationNameMicroelectronic engineering
local.citation.volume121
local.citation.startingPage68
local.citation.endingPage71


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