Show simple item record

dc.contributor.authorMolinero Giles, David
dc.contributor.authorCastañer Muñoz, Luis María
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2008-12-15T10:17:23Z
dc.date.available2008-12-15T10:17:23Z
dc.date.created2007-07-12
dc.date.issued2008-01-29
dc.identifier.citationMolinero, D.; Castañer, L. Comparison of air gap breakdown and substrate injection as mechanisms to induce dielectric charching in microelectromechanical switches. A: Applied Physics Letters, 2008, vol. 92, 043502.
dc.identifier.issn0003-6951
dc.identifier.urihttp://hdl.handle.net/2117/2442
dc.description.abstractExperiments show that air breakdown and substrate carrier conduction can be responsible of the dielectric charging of microelectromechanical devices after electrical stress. Test conducted under vacuum allows us to isolate the two mechanisms. It is also shown that the relative importance of the two mechanisms depends on the dielectric nature and technology.
dc.format.extent3
dc.language.isoeng
dc.publisherAmerican Institute of Physics
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica
dc.subject.lcshMicroelectromechanical systems.
dc.subject.lcshBreakdown (Electricity)
dc.subject.otherAir gap breakdown
dc.subject.otherDielectric charging
dc.subject.otherDielectric layer
dc.subject.otherDielectric thin films
dc.subject.otherElectric breakdown
dc.subject.otherElectrical stress
dc.subject.otherMicroelectromechanical switches
dc.subject.otherReliability
dc.subject.otherSubstrate carrier conduction
dc.subject.otherSubstrate injection
dc.subject.otherMEMS
dc.titleComparison of air gap breakdown and substrate injection as mechanisms to induce dielectric charching in microelectromechanical switches
dc.typeArticle
dc.subject.lemacSistemes microelectromecànics
dc.contributor.groupUniversitat Politècnica de Catalunya. MNT - Grup de Recerca en Micro i Nanotecnologies
dc.identifier.doi10.1663/1.2837615
dc.description.peerreviewedPeer Reviewed
dc.rights.accessRestricted access - publisher's policy


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record

All rights reserved. This work is protected by the corresponding intellectual and industrial property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public communication or transformation of this work are prohibited without permission of the copyright holder