Show simple item record

dc.contributor.authorBerbel Artal, Néstor
dc.contributor.authorFernández García, Raúl
dc.contributor.authorGil Galí, Ignacio
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2014-09-24T06:46:04Z
dc.date.created2014-08-01
dc.date.issued2014-08-01
dc.identifier.citationBerbel, N.; Fernandez-Garcia, R.; Gil, I. Characterization and modeling of the conducted emission of integrated circuits up to 3 GHz. "IEEE transactions on electromagnetic compatibility", 01 Agost 2014, vol. 56, núm. 4, p. 878-884.
dc.identifier.issn0018-9375
dc.identifier.urihttp://hdl.handle.net/2117/24147
dc.description.abstractIn this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.
dc.format.extent7 p.
dc.language.isoeng
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Circuits electrònics
dc.subject.lcshIntegrated circuits
dc.subject.lcshElectromagnetic compatibility
dc.subject.lcshMicrowave integrated circuits
dc.subject.lcshImpedance (Electricity)
dc.subject.otherConducted emissions
dc.subject.otherelectromagnetic compatibility (EMC)
dc.subject.otherfeature selective validation (FSV)
dc.subject.otherintegrated circuit (IC)
dc.subject.otherIC emission model (ICEM-CE)
dc.subject.otherinternal activity (IA)
dc.subject.othercomputational electromagnetics CEM
dc.subject.otherselective validation FSV
dc.titleCharacterization and modeling of the conducted emission of integrated circuits up to 3 GHz
dc.typeArticle
dc.subject.lemacCircuits integrats
dc.subject.lemacCompatibilitat electromagnètica
dc.subject.lemacCircuits integrats de microones
dc.subject.lemacImpedància (Electricitat)
dc.contributor.groupUniversitat Politècnica de Catalunya. (TIEG) - Terrassa Industrial Electronics Group
dc.identifier.doi10.1109/TEMC.2013.2294256
dc.description.peerreviewedPeer Reviewed
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac15075920
dc.description.versionPostprint (published version)
dc.date.lift10000-01-01
local.citation.authorBerbel, N.; Fernandez-Garcia, R.; Gil, I.
local.citation.publicationNameIEEE transactions on electromagnetic compatibility
local.citation.volume56
local.citation.number4
local.citation.startingPage878
local.citation.endingPage884


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record

All rights reserved. This work is protected by the corresponding intellectual and industrial property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public communication or transformation of this work are prohibited without permission of the copyright holder