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dc.contributor.authorBerbel Artal, Néstor
dc.contributor.authorFernández García, Raúl
dc.contributor.authorGil Galí, Ignacio
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.identifier.citationBerbel, N.; Fernandez-Garcia, R.; Gil, I. Characterization and modeling of the conducted emission of integrated circuits up to 3 GHz. "IEEE transactions on electromagnetic compatibility", 01 Agost 2014, vol. 56, núm. 4, p. 878-884.
dc.description.abstractIn this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.
dc.format.extent7 p.
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Circuits electrònics
dc.subject.lcshIntegrated circuits
dc.subject.lcshElectromagnetic compatibility
dc.subject.lcshMicrowave integrated circuits
dc.subject.lcshImpedance (Electricity)
dc.subject.otherConducted emissions
dc.subject.otherelectromagnetic compatibility (EMC)
dc.subject.otherfeature selective validation (FSV)
dc.subject.otherintegrated circuit (IC)
dc.subject.otherIC emission model (ICEM-CE)
dc.subject.otherinternal activity (IA)
dc.subject.othercomputational electromagnetics CEM
dc.subject.otherselective validation FSV
dc.titleCharacterization and modeling of the conducted emission of integrated circuits up to 3 GHz
dc.subject.lemacCircuits integrats
dc.subject.lemacCompatibilitat electromagnètica
dc.subject.lemacCircuits integrats de microones
dc.subject.lemacImpedància (Electricitat)
dc.contributor.groupUniversitat Politècnica de Catalunya. (TIEG) - Terrassa Industrial Electronics Group
dc.description.peerreviewedPeer Reviewed
dc.rights.accessRestricted access - publisher's policy
dc.description.versionPostprint (published version)
local.citation.authorBerbel, N.; Fernandez-Garcia, R.; Gil, I.
local.citation.publicationNameIEEE transactions on electromagnetic compatibility

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