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dc.contributor.authorArumi Delgado, Daniel
dc.contributor.authorRodríguez Montañés, Rosa
dc.contributor.authorFigueras Pàmies, Joan
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2013-10-31T11:34:26Z
dc.date.created2013
dc.date.issued2013
dc.identifier.citationArumi, D.; Rodriguez, R.; Figueras, J. BIST Architecture to Detect Defects in TSVs During Pre-Bond Testing. A: IEEE European Test Symposium. "Proceedings of 18th IEEE European Test Symposium". Avignon: Institute of Electrical and Electronics Engineers (IEEE), 2013.
dc.identifier.isbn978-1-4673-6377-8
dc.identifier.urihttp://hdl.handle.net/2117/20505
dc.descriptionbuilt-in self test integrated circuit testing three-dimensional integrated circuits
dc.description.abstractThrough Silicon Vias (TSVs) are critical elements in three dimensional integrated circuits (3-D ICs). The detection of defective TSVs in the earliest process step is of major concern. Hence, testing TSVs is usually done at different stages of the fabrication process. In this context, this work proposes a simple pre-bond GIST architecture to improve the detection of hard and weak defects
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica
dc.subject.lcshIntegrated circuits
dc.subject.lcshThree-dimensional integrated circuits
dc.subject.otherbuilt-in self test integrated circuit testing three-dimensional integrated circuits
dc.titleBIST Architecture to Detect Defects in TSVs During Pre-Bond Testing
dc.typeConference report
dc.subject.lemacCircuits integrats
dc.contributor.groupUniversitat Politècnica de Catalunya. QINE - Disseny de Baix Consum, Test, Verificació i Circuits Integrats de Seguretat
dc.identifier.doi10.1109/ETS.2013.6569389
dc.relation.publisherversionhttp://www.computer.org/csdl/proceedings/ets/2013/6376/00/06569389-abs.html
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac12791947
dc.description.versionPostprint (published version)
dc.date.lift10000-01-01
local.citation.authorArumi, D.; Rodriguez, R.; Figueras, J.
local.citation.contributorIEEE European Test Symposium
local.citation.pubplaceAvignon
local.citation.publicationNameProceedings of 18th IEEE European Test Symposium


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