BIST Architecture to Detect Defects in TSVs During Pre-Bond Testing
View/Open
bist_architecture.pdf (366,5Kb) (Restricted access)
Request copy
Document typeConference report
Defense date2013
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Rights accessRestricted access - publisher's policy
All rights reserved. This work is protected by the corresponding intellectual and industrial
property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public
communication or transformation of this work are prohibited without permission of the copyright holder
Abstract
Description
CitationArumi, D.; Rodriguez, R.; Figueras, J. BIST Architecture to Detect Defects in TSVs During Pre-Bond Testing. A: IEEE European Test Symposium. "Proceedings of 18th IEEE European Test Symposium". Avignon: Institute of Electrical and Electronics Engineers (IEEE), 2013.
ISBN978-1-4673-6377-8
Collections
- QINE - Disseny de Baix Consum, Test, Verificació i Tolerància a Fallades - Ponències/Comunicacions de congressos [60]
- QINE - Disseny de Baix Consum, Test, Verificació i Circuits Integrats de Seguretat - Ponències/Comunicacions de congressos [78]
- Departament d'Enginyeria Electrònica - Ponències/Comunicacions de congressos [1.728]
| Files | Description | Size | Format | View |
|---|---|---|---|---|
bist_architecture.pdf | 366,5Kb | Restricted access |