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dc.contributor.authorDuan, B.Y.
dc.contributor.authorLian, P.Y.
dc.description.abstractWith the rapid development of electronic equipment, coupling problem of the displacement field, electromagnetic field and temperature field is increasingly prominent. This paper focuses on the high-density packaging system, which is a kind of typical electromechanical- thermal coupling equipment. To begin with, the mathematical model is established and the electrical performance is expressed as a function of structural design variables and temperature. Then, the simplification method of the electromagnetic model and the transfer technology of grid information among different physical models are discussed. Last, the mathematical model for the optimization design based on the electro-mechanicalthermal coupling model is constructed, and satisfactory results have been obtained in the application of the optimization design model to the design of a high-density cabinet.
dc.format.extent11 p.
dc.subjectÀrees temàtiques de la UPC::Matemàtiques i estadística::Anàlisi numèrica::Mètodes en elements finits
dc.subject.lcshFinite element method
dc.subject.lcshCoupled problems (Complex systems) -- Numerical solutions
dc.subject.otherMulti-field-coupling Problem, High-density Packaging System, Information Transferring Technology, Model Simplification, Integrated Optimization Design
dc.titleThe coupled problem among displacement, thermo and electromagnetic fields and applications in electronic equipments
dc.typeConference report
dc.subject.lemacElements finits, Mètode dels
dc.rights.accessOpen Access
local.citation.contributorCOUPLED V
local.citation.publicationNameCOUPLED V : proceedings of the V International Conference on Computational Methods for Coupled Problems in Science and Engineering :

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