The influence of thermal barriers in anisotropic media applied to PCB using MEC

Abstract

Many electronical components were developed during the last years and many efforts were devoted to the miniaturization of their components due to the global tendency. The matrix in which the components are mounted are made of composite materials which presented anisotropic behaviour. The main goal of this work relies on determining the influence of the thermal barriers position inside of a PCB. The plate has 168 thermal barriers inside the domain where each one has a 360° of freedom of rotation. A Dirichlet boundary condition was imposed to all corners of the plate to analysis. The heat flux was observed at the A, B, and C corners, as the internal barriers were rotated. A quadratic boundary element was used and The multipoint Genetic Algorithm was employed in order to maximize the objective function at the corner A and minimizing at the corners B and C. Despite the elevated number of variables classified this problem such as non-convex, the final results showed good convergence.