Coupled solid piezoelectric and shell inversepiezoelectric analysis using partitioned method for thin piezoelectric bimorph with metal layers
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In this study, the coupled solid piezoelectric and shell inverse-piezoelectric analysis method for a thin piezoelectric bimorph with metal layers is proposed. The piezoelectric bimorph is usually thin and includes the metal layers such as the electrode and the shim plate. In the proposed method, the solid and shell elements are used for the piezoelectric and inverse-piezoelectric analyses, respectively, since the solid elements can describe the various types of the distributions of the electric potential along the thickness, and the shell elements are suitable for analyzing the thin structure. The block Gauss-Seidel method is used to couple the solid piezoelectric and shell inverse-piezoelectric analyses. In the iterative passing of the solution variables, the transformation method is used between the solid and shell elements. The rules of mixture for the bending rigidity and the mass are used for modeling the single shell structure in the inverse-piezoelectric analysis. A pseudo-piezoelectric modeling for the conductor is proposed to consider the metal layers in the piezoelectric analysis. This modeling allows us to reuse existing programs of the piezoelectric analysis without any modification.