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dc.contributorSoria Guerrero, Manel
dc.contributor.authorHuete Ibán, David
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Física
dc.date.accessioned2020-05-21T08:21:58Z
dc.date.issued2018-09-10
dc.identifier.urihttp://hdl.handle.net/2117/188412
dc.descriptionDesign, implement and test a PCB conceived for thermal analysis in a vacuum chamber
dc.description.abstractThe main objective of this paper is the study of the thermal behaviour of spacecrafts PCB. Specifically, the work is focused on obtaining experimental data of the thermal contact resistance of a spacer in a PCB in therms of the joint tightening. It is carried out with three different experiments on a PCB: the study of the thermal contact resistance of an spacer, the thermal resistance of a via, and the thermal through plane resistance. A PCB is designed featuring these three different experiments, which are meant to be performed in a vacuum chamber, in order to recreate space conditions.
dc.language.isoeng
dc.publisherUniversitat Politècnica de Catalunya
dc.subjectÀrees temàtiques de la UPC::Aeronàutica i espai::Aeronaus
dc.subject.lcshSpace vehicles
dc.subject.lcshArtificial satellites
dc.titleExperimental testing of the thermal behaviour of spacecraft PCBs
dc.title.alternativeStudy: experimental testing of the thermal behaviour of spacecraft PCBs
dc.typeBachelor thesis
dc.subject.lemacVehicles espacials
dc.subject.lemacSatèl·lits artificials -- Dinàmica
dc.identifier.slug205-1690
dc.rights.accessRestricted access - author's decision
dc.date.lift10000-01-01
dc.date.updated2019-10-24T11:03:19Z
dc.audience.educationlevelGrau
dc.audience.mediatorEscola Superior d'Enginyeries Industrial, Aeroespacial i Audiovisual de Terrassa
dc.audience.degreeGRAU EN ENGINYERIA EN TECNOLOGIES AEROESPACIALS (Pla 2010)


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