STT-MRAM for real-time embedded systems: performance and WCET implications

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Document typeConference report
Defense date2019
PublisherAssociation for Computing Machinery (ACM)
Rights accessOpen Access
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ProjectCOMPUTACION DE ALTAS PRESTACIONES VII (MINECO-TIN2015-65316-P)
ExaNoDe - European Exascale Processor Memory Node Design (EC-H2020-671578)
RYC-2013-14717 (MINECO-RYC-2013-14717)
BARCELONA SUPERCOMPUTING CENTER - CENTRO. NACIONAL DE SUPERCOMPUTACION (MINECO-SEV-2015-0493)
ExaNoDe - European Exascale Processor Memory Node Design (EC-H2020-671578)
RYC-2013-14717 (MINECO-RYC-2013-14717)
BARCELONA SUPERCOMPUTING CENTER - CENTRO. NACIONAL DE SUPERCOMPUTACION (MINECO-SEV-2015-0493)
Abstract
STT-MRAM is an emerging non-volatile memory quickly approaching DRAM in terms of capacity, frequency and device size. Intensified efforts in STT-MRAM research by the memory manufacturers may indicate a revolution with STT-MRAM memory technology is imminent, and therefore it is essential to perform system level research to explore use-cases and identify computing domains that could benefit from this technology. Special STT-MRAM features such as intrinsic radiation hardness, non-volatility, zero stand-by power and capability to function in extreme temperatures makes it particularly suitable for aerospace, avionics and automotive applications. Such applications often have real-time requirements --- that is, certain tasks must complete within a strict deadline. Analyzing whether this deadline is met requires Worst Case Execution Time (WCET) Analysis, which is a fundamental part of evaluating any real-time system. In this study, we investigate the feasibility of using STT-MRAM in real-time embedded systems by analyzing average system performance impact and WCET implications.
CitationAsifuzzaman, K. [et al.]. STT-MRAM for real-time embedded systems: performance and WCET implications. A: International Symposium on Memory Systems. "MEMSYS 2019: proceedings of the International Symposium on Memory Systems: Washington DC, September 30–October 3, 2019". New York: Association for Computing Machinery (ACM), 2019, p. 195-205.
ISBN978-1-4503-7206-0
Publisher versionhttps://dl.acm.org/doi/10.1145/3357526.3357531
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