An arbitrary lagrangian-eulerian (ale) approach for the modeling of tensión leveling processes
Document typeConference report
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Strip flatness and surface quality are crucial factors for the production of high-quality cold-rolled metal strip. Tension leveling (employed as one of the final steps in continuous galvanizing and finishing lines) improves strip flatness and minimizes residual stresses by inducing small elasto-plastic strip deformations, while the strip is bent under high tension stresses around multiple rolls with small diameters. Simulations of tension leveling processes employing commercial Finite Element software packages yield unacceptable computational costs: The small and coupled elasto-plastic deformations occur simultaneously at concentrated regions along the strip bending line and steady-state solutions cannot be reached before at least one strip cross-section has passed through the entire process unit of the tension leveler. In order to overcome these critical aspects, a new and alternative modeling approach, based on the principle of virtual work and on a specialized “Arbitrary Lagrangian-Eulerian” (ALE) formulation was elaborated. This novel concept utilizes “Parametric Shape Func- tions” (PSF) that describe both geometry and strain distribution of the deformed strip. The decoupling of the mesh movement from the material movement in the ALE descrip- tion allows for the implementation of highly efficient contact algorithms, while the strip length under consideration can be minimized. Compared to (already) optimized com- mercial FEM-models, the PSF-model exhibits a drastic reduction of degrees of freedom and computational costs (by a factor of 100 and more in typical test cases) while high agreement of the key results is simultaneously maintained.
CitationSteinwender, L. [et al.]. An arbitrary lagrangian-eulerian (ale) approach for the modeling of tensión leveling processes. A: COMPLAS XI. "COMPLAS XI : proceedings of the XI International Conference on Computational Plasticity : fundamentals and applications". CIMNE, 2011, p. 1092-1103.
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