Numerical simulations of vickers indentation crack growth in ferroelectric single crystals: effect of microstructure on the fracture process
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Ferroelectric materials exhibit strong electro-mechanical coupling which make them ideal materials for use in electro-mechanical devices such as sensors, actuators and transducers. To assure optimum reliability of these devices, understanding of the fracture behavior in these materials is essential. The complex nonlinear interactions of the mechanical and electrical ﬁelds in the vicinity of the crack, with localized switching phenomena, govern the fracture behavior of ferroelectric materials. Experimental techniques have been used to study fracture in ferroelectrics, including Vickers indentation to investigate the fracture toughness anisotropy [1–5]. Experiments show that cracking along the poling direction of the material has a shorter length and consequently a higher eﬀective fracture toughness than that normal to the poling direction. In this paper we introduce a model able to capture the anisotropic crack growth under Vickers indentation loading. This anisotropy is obtained by linking the crack propagation with the microstructural phenomena. The model treats in a coupled phase-ﬁeld energetic fashion both the brittle crack propagation and the microstructure evolution. We have recently presented a model, showing that the interaction of the microstructure and the crack leads to a slow-fast crack propagation behavior observed in experiment . In Ref. , we have introduced a modiﬁcation in the formulation to endow the phase-ﬁeld model with the ability to simulate the aforementioned anisotropic crack growth. We present here the highlights of that work. The theory of the coupled phase-ﬁeld model is summarized in Section 2. Simulation results are presented and discussed in Section 3. The last Section is the conclusion of this paper.
CitationAbdollahi Hosnijeh, A.; Arias Vicente, I. Numerical simulations of vickers indentation crack growth in ferroelectric single crystals: effect of microstructure on the fracture process. A: COMPLAS XI. "COMPLAS XI : proceedings of the XI International Conference on Computational Plasticity : fundamentals and applications". CIMNE, 2011, p. 514-520.
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