Distributed feedback-aided subspace concurrent opportunistic communications

Borràs Pino, Jordi; Vázquez Grau, Gregorio

doi:10.1109/SPAWC.2019.8815484

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Borràs Pino, Jordi

Vázquez Grau, Gregorio

Document typeConference lecture

Defense date2019

PublisherInstitute of Electrical and Electronics Engineers (IEEE)

Rights accessOpen Access

All rights reserved. This work is protected by the corresponding intellectual and industrial property rights. Without prejudice to any existing legal exemptions, reproduction, distribution, public communication or transformation of this work are prohibited without permission of the copyright holder

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Abstract

This paper deals with the distributed subspace agreement problem for opportunistic communications in time division duplex (TDD) distributed networks. Since scenario-adapted opportunistic transmission schemes rely on locally sampled observations from the wireless environment, degrees-of-freedom (DoF) sensed as available at any node may differ. Transmitting information without agreeing the common active subspace may incur in a performance loss due to noise enhancement, energy loss and inter-system interference. In this context, we propose two subspace concurrence schemes with and without side information about neighboring user's DoF.

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© 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

CitationBorras, J.; Vazquez, G. Distributed feedback-aided subspace concurrent opportunistic communications. A: IEEE International Workshop on Signal Processing Advances in Wireless Communications. "2019 IEEE 20th International Workshop on Signal Processing Advances in Wireless Communications (SPAWC 2019): 2-5 July 2019: Cannes, France". Institute of Electrical and Electronics Engineers (IEEE), 2019, p. 1-5.

URIhttp://hdl.handle.net/2117/173930

DOI10.1109/SPAWC.2019.8815484

ISBN978-1-5386-6529-9

Publisher versionhttps://ieeexplore.ieee.org/document/8815484

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