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Bonding-wire triangular spiral inductor for on-chip switching power converters
dc.contributor.author | Villar Piqué, Gerard |
dc.contributor.author | Delós, Julià |
dc.contributor.author | Alarcón Cot, Eduardo José |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2012-02-26T10:52:54Z |
dc.date.available | 2012-02-26T10:52:54Z |
dc.date.created | 2011 |
dc.date.issued | 2011 |
dc.identifier.citation | Villar, G.; Delós, J.; Alarcón, E. Bonding-wire triangular spiral inductor for on-chip switching power converters. A: IEEE International Symposium on Circuits and Systems. "ISCAS 2011 the IEEE International Symposium on Circuits and Systems: proceedings". Rio de Janeiro: IEEE, 2011, p. 817-820. |
dc.identifier.isbn | 978-1-4244-9472-9 |
dc.identifier.uri | http://hdl.handle.net/2117/15368 |
dc.description.abstract | This work presents the first design and modelling of bonding-wire-based triangular spiral inductors (Fig. 1), targeting their application to on-chip switching power converters. It is demonstrated that the equilateral triangular shape compared to other polygonal shapes best balances the inductive density as well as the total Equivalent Series Resistance (ESR). Afterwards, a design procedure is presented in order to optimize the inductor design, in terms of ESR and occupied area reduction. Finally, finite-elements simulation results of an optimized design (27nH, 1 Ω) are presented to validate the proposed expressions |
dc.format.extent | 4 p. |
dc.language.iso | eng |
dc.publisher | IEEE |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica::Electrònica de potència |
dc.subject.lcsh | On-chip switching power converter |
dc.subject.lcsh | Bonding-wire |
dc.title | Bonding-wire triangular spiral inductor for on-chip switching power converters |
dc.type | Conference report |
dc.subject.lemac | Convertidors de corrent elèctric |
dc.contributor.group | Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits |
dc.identifier.doi | 10.1109/ISCAS.2011.5937691 |
dc.description.peerreviewed | Peer Reviewed |
dc.relation.publisherversion | http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=05937691 |
dc.rights.access | Restricted access - publisher's policy |
local.identifier.drac | 9366596 |
dc.description.version | Postprint (published version) |
local.citation.author | Villar, G.; Delós, J.; Alarcón, E. |
local.citation.contributor | IEEE International Symposium on Circuits and Systems |
local.citation.pubplace | Rio de Janeiro |
local.citation.publicationName | ISCAS 2011 the IEEE International Symposium on Circuits and Systems: proceedings |
local.citation.startingPage | 817 |
local.citation.endingPage | 820 |