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dc.contributor.authorAvramopoulos, Hércules
dc.contributor.authorKlein, E.J.
dc.contributor.authorStamatiadis, C.
dc.contributor.authorVyrsokinos, K.
dc.contributor.authorStampoulidis, L.
dc.contributor.authorLazarou, I.
dc.contributor.authorSchrenk, Bernhard
dc.contributor.authorLeinse, A.
dc.contributor.authorHeideman, R.
dc.contributor.authorBruinink, C.
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Teoria del Senyal i Comunicacions
dc.date.accessioned2011-09-28T09:48:22Z
dc.date.available2011-09-28T09:48:22Z
dc.date.created2011
dc.date.issued2011
dc.identifier.citationStamatiadis, C. [et al.]. Fabrication and experimental demonstration of a four-channel × 40 Gb/s TriPleX all-optical wavelength conversion platform. "Journal of lightwave technology", 2011, vol. 29, núm. 12, p. 1886-1891.
dc.identifier.issn0733-8724
dc.identifier.urihttp://hdl.handle.net/2117/13373
dc.description.abstractWe present a scalable circuit that performs multichannel, all-optical wavelength conversion employing semiconductor optical amplifiers (SOAs) and a densely integrated TriPleX photonic chip. The TriPleX device performs chirp filtering and signal polarity inversion with on-chip signal processing. The chip includes a total number of 40 arrays of Si3 N4–SiO2 microring resonators, delay interferometers and heating elements. The total footprint of each array is 2.19mm2 and the power consumption per integrated heater is below 80 mW. We have interconnected the TriPleX chip with SOAs and we demonstrate experimentally 4x40 Gb/s, parallel and wavelength tunable wavelength conversion with power penalties of less than 3 dB.
dc.format.extent6 p.
dc.language.isoeng
dc.subject.lcshOptical device fabrication
dc.subject.lcshOptical filtres
dc.subject.lcshOptical waveguides
dc.subject.lcshOptical wavelength conversion
dc.subject.lcshSemiconductor optical amplifiers
dc.titleFabrication and experimental demonstration of a four-channel × 40 Gb/s TriPleX all-optical wavelength conversion platform
dc.typeArticle
dc.subject.lemacFotònica
dc.subject.lemacAmplificadors òptics semiconductors
dc.identifier.doi10.1109/JLT.2011.2148692
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5754563
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac5960377
dc.description.versionPostprint (published version)
dc.relation.projectidinfo:eu-repo/grantAgreement/EC/FP7/224375/EU/Terabit-on-chip: micro and nano-scale silicon photonic integrated components and sub-systems enabling Tb%2Fs-capacity, scalable and fully integrated photonic routers/BOOM
local.citation.authorStamatiadis, C.; Vyrsokinos, K.; Stampoulidis, L.; Lazarou, I.; Schrenk, B.; Leinse, A.; Heideman, R.; Bruinink, C.; Klein, E.; Avramapoulos, H.
local.citation.publicationNameJournal of lightwave technology
local.citation.volume29
local.citation.number12
local.citation.startingPage1886
local.citation.endingPage1891


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