THERMAL OBSERVATION OF A MODULATED INPUT FOR A 2.5GHZ CMOS POWER AMPLIFIER Part 3: PA+Sensor layout integration and PVT analysis
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Report 16 Mayo 2011.pdf (1,639Mb) (Restricted access)
Document typeExternal research report
Date issued2011-05-16
Rights accessRestricted access - publisher's policy
Abstract
The objective is to detect the impact of PVT variations (Process, Voltage and Temperature variations) on the figures of merit of a device.
CitationMartín, M.; González, J. "THERMAL OBSERVATION OF A MODULATED INPUT FOR A 2.5GHZ CMOS POWER AMPLIFIER Part 3: PA+Sensor layout integration and PVT analysis". 2011.
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