Incremental learning framework-based condition monitoring for novelty fault identification applied to electromechanical systems
Document typeConference report
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Rights accessOpen Access
A great deal of investigations are being carried out towards the effective implementation of the 4.0 Industry new paradigm. Indeed, most of the machinery involved in industrial processes are intended to be digitalized aiming to obtain enhanced information to be used for an optimized operation of the whole manufacturing process. In this regard, condition monitoring strategies are being also reconsidered to include improved performances and functionalities. Thus, the contribution of this research work lies in the proposal of an incremental learning framework approach applied to the condition monitoring of electromechanical systems. The proposed strategy is divided in three main steps, first, different available physical magnitudes are characterized through the calculation of a set of statistical-time based features. Second, a modelling of the considered conditions is performed by means of self-organizing maps in order to preserve the topology of the data; and finally, a novelty detection is carried out by a comparison among the quantization error value achieved in the data modelling for each of the considered conditions. The effectiveness of the proposed novelty fault identification condition monitoring methodology is proved by means of the evaluation of a complete experimental database acquired during the continuous working conditions of an electromechanical system. © 2018 IEEE.
CitationSaucedo, J., Delgado Prieto, M., Cariño, J. A., Osornio, R., Romeral, L., Romero, R. Incremental learning framework-based condition monitoring for novelty fault identification applied to electromechanical systems. A: IEEE International Conference on Emerging Technologies and Factory Automation. "2018 IEEE 23rd International Conference on Emerging Technologies and Factory Automation (ETFA): Politecnico di Torino, Torino, Italy, 04-07 September, 2018: proceedings". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1359-1364.
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