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Millimeter-wave propagation within a computer chip package
dc.contributor.author | Timoneda, Xavier |
dc.contributor.author | Abadal Cavallé, Sergi |
dc.contributor.author | Cabellos Aparicio, Alberto |
dc.contributor.author | Manessis, Dionyssios |
dc.contributor.author | Zhou, Jin |
dc.contributor.author | Franques, Antonio |
dc.contributor.author | Torrellas, Josep |
dc.contributor.author | Alarcón Cot, Eduardo José |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors |
dc.contributor.other | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
dc.date.accessioned | 2018-06-20T14:15:12Z |
dc.date.available | 2018-06-20T14:15:12Z |
dc.date.issued | 2018 |
dc.identifier.citation | Timoneda, X., Abadal, S., Albert Cabellos-Aparicio, Manessis, D., Zhou, J., Franques, A., Torrellas, J., Alarcon, E. Millimeter-wave propagation within a computer chip package. A: IEEE International Symposium on Circuits and Systems. "2018 IEEE International Symposium on Circuits and Systems (ISCAS): proceedings: 27-30 May 2018: Florence, Italy". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-5. |
dc.identifier.isbn | 978-1-5386-4882-7 |
dc.identifier.uri | http://hdl.handle.net/2117/118233 |
dc.description | © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
dc.description.abstract | Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM). |
dc.format.extent | 5 p. |
dc.language.iso | eng |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) |
dc.subject | Àrees temàtiques de la UPC::Enginyeria de la telecomunicació::Radiocomunicació i exploració electromagnètica::Antenes i agrupacions d'antenes |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats |
dc.subject.lcsh | Antennas (Electronics) |
dc.subject.lcsh | Integrated circuits |
dc.subject.other | Antennas |
dc.subject.other | Silicon |
dc.subject.other | Integrated circuit interconnections |
dc.subject.other | Wires |
dc.subject.other | Heat sinks |
dc.subject.other | Ceramics |
dc.subject.other | Wireless communication |
dc.title | Millimeter-wave propagation within a computer chip package |
dc.type | Conference report |
dc.subject.lemac | Antenes (Electrònica) |
dc.subject.lemac | Circuits integrats |
dc.contributor.group | Universitat Politècnica de Catalunya. CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla |
dc.contributor.group | Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits |
dc.identifier.doi | 10.1109/ISCAS.2018.8351875 |
dc.description.peerreviewed | Peer Reviewed |
dc.relation.publisherversion | https://ieeexplore.ieee.org/document/8351875/ |
dc.rights.access | Open Access |
local.identifier.drac | 21978947 |
dc.description.version | Postprint (author's final draft) |
dc.relation.projectid | info:eu-repo/grantAgreement/MINECO//PCIN-2015-012/ES/HACIA LAS COMUNICACIONES RF BASADAS EN GRAFENO ? DEMOSTRANDO LAS ANTENAS DE GRAFENO THZ PLASMONICAS./ |
dc.relation.projectid | info:eu-repo/grantAgreement/EC/H2020/736876/EU/VisorSurf/VISORSURF |
local.citation.author | Timoneda, X.; Abadal, S.; Cabellos-Aparicio, Albert; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E. |
local.citation.contributor | IEEE International Symposium on Circuits and Systems |
local.citation.publicationName | 2018 IEEE International Symposium on Circuits and Systems (ISCAS): proceedings: 27-30 May 2018: Florence, Italy |
local.citation.startingPage | 1 |
local.citation.endingPage | 5 |