Millimeter-wave propagation within a computer chip package
Document typeConference report
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Rights accessOpen Access
European Commisision's projectVISORSURF - VisorSurf (EC-H2020-736876)
Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).
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CitationTimoneda, X., Abadal, S., Albert Cabellos-Aparicio, Manessis, D., Zhou, J., Franques, A., Torrellas, J., Alarcon, E. Millimeter-wave propagation within a computer chip package. A: IEEE International Symposium on Circuits and Systems. "2018 IEEE International Symposium on Circuits and Systems (ISCAS): proceedings: 27-30 May 2018: Florence, Italy". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-5.