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dc.contributor.authorHutchinson, John M.
dc.contributor.authorRomán Concha, Frida Rosario
dc.contributor.authorFolch, Adrià
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Màquines i Motors Tèrmics
dc.date.accessioned2018-06-12T14:16:32Z
dc.date.available2018-06-12T14:16:32Z
dc.date.issued2018-03-20
dc.identifier.citationHutchinson, J.M., Roman, F., Folch, A. Epoxy-thiol systems filled with boron nitride for high thermal conductivity applications. "Polymers", 20 Març 2018, vol. 10, núm. 3 (340), p. 1-18.
dc.identifier.issn2073-4360
dc.identifier.urihttp://hdl.handle.net/2117/118040
dc.description.abstractAn epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal conductivity of the cured samples has been measured by the transient hot bridge method. The heat of reaction and the glass transition temperature of the fully cured samples are both independent of the BN content, but the cure reaction kinetics is not: with increasing BN content, the reaction first advances and is then delayed, this behaviour being more pronounced than for the same system with 6 µm BN particles, investigated previously. This dependence on BN content is attributed to the effects of heat transfer, and the DSC results can be correlated with the thermal conductivity of the cured systems, which is found to increase with both BN content and BN particle size. For a given BN content, the values of thermal conductivity obtained are significantly higher than many others reported in the literature, and achieve a value of over 4.0 W/mK for a BN content of about 40 vol %.
dc.format.extent18 p.
dc.language.isoeng
dc.rightsAttribution 3.0 Spain
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria dels materials::Assaig de materials
dc.subject.lcshEpoxy compounds--Testing
dc.subject.lcshThermal conductivity
dc.subject.lcshBoron nitride
dc.subject.lcshCalorimetry
dc.subject.otherEpoxy
dc.subject.otherThiol
dc.subject.otherBoron nitride
dc.subject.otherDifferential scanning calorimetry (DSC)
dc.subject.otherThermal conductivity
dc.titleEpoxy-thiol systems filled with boron nitride for high thermal conductivity applications
dc.typeArticle
dc.subject.lemacEpòxids
dc.subject.lemacCalor -- Conducció
dc.subject.lemacNitrur de bor
dc.contributor.groupUniversitat Politècnica de Catalunya. POLTEPO - Polímers Termoestables Epoxídics
dc.identifier.doi10.3390/polym10030340
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://www.mdpi.com/2073-4360/10/3/340
dc.rights.accessOpen Access
local.identifier.drac23182245
dc.description.versionPostprint (published version)
local.citation.authorHutchinson, J.M.; Roman, F.; Folch, A.
local.citation.publicationNamePolymers
local.citation.volume10
local.citation.number3 (340)
local.citation.startingPage1
local.citation.endingPage18


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Attribution 3.0 Spain
Except where otherwise noted, content on this work is licensed under a Creative Commons license : Attribution 3.0 Spain