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dc.contributor.authorIsarn, Isaac
dc.contributor.authorRamis Juan, Xavier
dc.contributor.authorFerrando Piera, Francesc
dc.contributor.authorSerra Albet, Maria Àngels
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Màquines i Motors Tèrmics
dc.date.accessioned2018-05-11T10:29:07Z
dc.date.available2018-05-11T10:29:07Z
dc.date.issued2018-03-07
dc.identifier.citationIsarn, I., Ramis, X., Ferrando, F., Serra, M. À. Thermoconductive thermosetting composites based on boron nitride fillers and thiol-epoxy matrices. "Polymers", 7 Març 2018, vol. 10, núm. 3, p. 1-18.
dc.identifier.issn2073-4360
dc.identifier.urihttp://hdl.handle.net/2117/117134
dc.description.abstractIn this work, the effect of the addition of boron nitride (BN) fillers in a thiol-cycloaliphatic epoxy formulation has been investigated. Calorimetric studies put into evidence that the kinetics of the curing has been scarcely affected and that the addition of particles does not affect the final structure of the network. Rheologic studies have shown the increase in the viscoelastic properties on adding the filler and allow the percolation threshold to be calculated, which was found to be 35.5%. The use of BN agglomerates of bigger size increases notably the viscosity of the formulation. Glass transition temperatures are not affected by the filler added, but Young’s modulus and hardness have been notably enhanced. Thermal conductivity of the composites prepared shows a linear increase with the proportion of BN particle sheets added, reaching a maximum of 0.97 W/K·m. The addition of 80 µm agglomerates, allowed to increase this value until 1.75 W/K·m.
dc.format.extent18 p.
dc.language.isoeng
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria dels materials::Materials plàstics i polímers
dc.subjectÀrees temàtiques de la UPC::Física::Termodinàmica
dc.subject.lcshEpoxy resins
dc.subject.lcshThermodynamics
dc.subject.otherCycloaliphatic epoxy resin
dc.subject.otherComposites
dc.subject.otherThermal conductivity
dc.subject.otherBoron nitride
dc.subject.otherThiol-epoxy
dc.titleThermoconductive thermosetting composites based on boron nitride fillers and thiol-epoxy matrices
dc.typeArticle
dc.subject.lemacResines epoxídiques
dc.subject.lemacTermodinàmica
dc.contributor.groupUniversitat Politècnica de Catalunya. POLTEPO - Polímers Termoestables Epoxídics
dc.identifier.doi10.3390/polym10030277
dc.relation.publisherversionhttp://www.mdpi.com/2073-4360/10/3/277
dc.rights.accessOpen Access
local.identifier.drac22025204
dc.description.versionPostprint (published version)
local.citation.authorIsarn, I.; Ramis, X.; Ferrando, F.; Serra, M. À.
local.citation.publicationNamePolymers
local.citation.volume10
local.citation.number3
local.citation.startingPage1
local.citation.endingPage18


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Attribution-NonCommercial-NoDerivs 3.0 Spain
Except where otherwise noted, content on this work is licensed under a Creative Commons license : Attribution-NonCommercial-NoDerivs 3.0 Spain