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Dry transfer of graphene to dielectrics and flexible substrates using polyimide as a transparent and stable intermediate layer
dc.contributor.author | Marchena, Miriam |
dc.contributor.author | Wagner, Frederic |
dc.contributor.author | Arliguie, Therese |
dc.contributor.author | Zhu, Bin |
dc.contributor.author | Johnson, Benedict |
dc.contributor.author | Fernández, Manuel |
dc.contributor.author | Chen, Tong Lai |
dc.contributor.author | Chang, Theresa |
dc.contributor.author | Lee, Robert |
dc.contributor.author | Pruneri, Valerio |
dc.contributor.author | Mazumder, Prantik |
dc.contributor.other | Universitat Politècnica de Catalunya. Institut de Ciències Fotòniques |
dc.date.accessioned | 2018-04-30T13:39:57Z |
dc.date.available | 2018-04-30T13:39:57Z |
dc.date.issued | 2018-04-30 |
dc.identifier.citation | Marchena, M. [et al.]. Dry transfer of graphene to dielectrics and flexible substrates using polyimide as a transparent and stable intermediate layer. "2D Materials", 30 Abril 2018. |
dc.identifier.issn | 2053-1583 |
dc.identifier.uri | http://hdl.handle.net/2117/116837 |
dc.description.abstract | We demonstrate the direct transfer of graphene from Cu foil to glass and flexible substrates such as PET, using polyimide (PI) mixed with an aminosilane (3-aminopropyltrimethoxysilane) or only PI, respectively, as intermediate layer. We probe the scalability and roll-to-roll processing of this technique by using two different equipment: hot press and a laminator. High quality, clean and continuous areas of graphene monolayer can be transferred with the advantage of Cu recycling for future growth catalyst as it is peeled-off mechanically from the substrate/PI/graphene structure. More important are the high transparency of the samples together with the electron doping achieved (n<sub>S</sub>= 0.21 to 4 x 10<sup>13</sup> cm<sup>-2</sup>), as the performing graphene face is not in direct contact with PMMA, PI or other materials, and the high mobility (µ<sub>H</sub> up to 1250 cm<sup>2</sup>/Vcenterdots). Stability of the structure in terms of sheet resistance (R<sub>S</sub>) at high temperatures, bending cycles and water immersion make this technique promising for future applications and implementation at the large scale. |
dc.format.extent | 25 p. |
dc.language.iso | spa |
dc.publisher | IOP |
dc.rights | Attribution-NonCommercial-NoDerivs 3.0 Spain |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/es/ |
dc.subject | Àrees temàtiques de la UPC::Física |
dc.subject.lcsh | Graphene |
dc.subject.other | grafè |
dc.title | Dry transfer of graphene to dielectrics and flexible substrates using polyimide as a transparent and stable intermediate layer |
dc.type | Article |
dc.subject.lemac | Grafè |
dc.relation.publisherversion | http://iopscience.iop.org/article/10.1088/2053-1583/aac12d |
dc.rights.access | Open Access |
dc.description.version | Postprint (author's final draft) |
dc.relation.projectid | info:eu-repo/grantAgreement/MINECO//SEV-2015-0522/ES/AGR-INSTITUTO DE CIENCIAS FOTONICAS/ |
local.citation.publicationName | 2D Materials |
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