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dc.contributorAlarcón Cot, Eduardo José
dc.contributorAbadal Cavallé, Sergi
dc.contributor.authorTimoneda i Comas, Xavier
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
dc.date.accessioned2018-03-02T10:00:43Z
dc.date.available2018-03-02T10:00:43Z
dc.date.issued2017-10-20
dc.identifier.urihttp://hdl.handle.net/2117/114732
dc.description.abstractWireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics as current chip multiprocessors are scaled. There have been plenty of works analyzing the WNoC paradigm from the physical, network and architecture layers. However, the propagation of millimeter waves inside a computing package is still not fully understood. As a result, aspects such as the path loss or the delay spread have not been precisely evaluated yet. This thesis tries to address this issue by accurately modeling a processor chip within a flip-chip package and investigating the wave propagation inside it. Then, through parametric studies, a potentially optimal configuration for 60 GHz WNoC is obtained. Finally, path loss and delay spread are evaluated for a set of representative scenarios, showing that chip-wide attenuation below -34,3 dB and channel capacity above 100 Gbps could be achieved.
dc.description.abstractWireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics as current chip multiprocessors are scaled. There have been plenty of works analyzing the WNoC paradigm from the physical, network and architecture layers. However, the propagation of millimeter waves inside a computing package is still not fully understood. As a result, aspects such as the path loss or the delay spread have not been precisely evaluated yet. This thesis tries to address this issue by accurately modeling a processor chip within a flip-chip package and investigating the wave propagation inside it. Then, through parametric studies, a potentially optimal configuration for 60 GHz WNoC is obtained. Finally, path loss and delay spread are evaluated for a set of representative scenarios, showing that chip-wide attenuation below -34,3 dB and channel capacity above 100 Gbps could be achieved.
dc.description.abstractWireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics as current chip multiprocessors are scaled. There have been plenty of works analyzing the WNoC paradigm from the physical, network and architecture layers. However, the propagation of millimeter waves inside a computing package is still not fully understood. As a result, aspects such as the path loss or the delay spread have not been precisely evaluated yet. This thesis tries to address this issue by accurately modeling a processor chip within a flip-chip package and investigating the wave propagation inside it. Then, through parametric studies, a potentially optimal configuration for 60 GHz WNoC is obtained. Finally, path loss and delay spread are evaluated for a set of representative scenarios, showing that chip-wide attenuation below -34,3 dB and channel capacity above 100 Gbps could be achieved.
dc.language.isoeng
dc.publisherUniversitat Politècnica de Catalunya
dc.rightsS'autoritza la difusió de l'obra mitjançant la llicència Creative Commons o similar 'Reconeixement-NoComercial- SenseObraDerivada'
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria de la telecomunicació
dc.subject.lcshMultiprocessors
dc.subject.lcshWaves -- Propagation
dc.subject.otherPropagation
dc.subject.otherchannel characterization
dc.subject.othermultiprocessors
dc.subject.otherPropagación
dc.subject.otherCaracterización de canal
dc.subject.othermultiprocesadores
dc.subject.otherSimulador de canal d'alta freqüència
dc.titlemmWave propagation within a computing package
dc.title.alternativePropagación electromagnética dentro de un procesador multicore
dc.title.alternativePropagació electromagnètica dins d'un processador multicore
dc.title.alternativeEM propagation within a computing package
dc.typeBachelor thesis
dc.subject.lemacMultiprocessadors
dc.subject.lemacOnes -- Propagació
dc.identifier.slugETSETB-230.128650
dc.rights.accessOpen Access
dc.date.updated2017-10-24T05:50:42Z
dc.audience.educationlevelGrau
dc.audience.mediatorEscola Tècnica Superior d'Enginyeria de Telecomunicació de Barcelona


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