User association in 5G heterogeneous networks with mesh millimeter wave backhaul links

Cita com:
hdl:2117/114287
Document typeConference report
Defense date2017
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Rights accessOpen Access
Except where otherwise noted, content on this work
is licensed under a Creative Commons license
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Attribution-NonCommercial-NoDerivs 3.0 Spain
Abstract
Fifth generation (5G) wireless networks will target
at energy and spectrum efficient solutions to cope with the
increasing demands in capacity and energy efficiency. To achieve
this joint goal, dense networks of small cells (SCs) are expected to
overlay the existing macro cells. In parallel, for the SC connection
to the core network, a promising solution lies in a mesh network
of high capacity millimeter wave backhaul (BH) links. In the
considered 5G architecture, each SC is able to forward its
BH traffic to the core network through alternative paths, thus
offering high BH network reliability. In this context, the joint
problem of user association and BH routing becomes challenging.
In this paper, we focus on this problem targeting at energy
and spectrum efficient solutions. A low-complexity algorithm
is proposed, which bases its user association and BH routing
decision i) on minimizing the spectrum resources to guarantee
the user rate, so as to provide high spectrum efficiency, and ii)
on minimizing both the access network and BH route power
consumption to provide high energy efficiency. Our results show
that our solution provides better trade-offs between energy and
spectrum efficiency than the state-of-the-art in 3GPP scenarios
CitationMesodiakaki, A., Zola, E., Kassler, A.J. User association in 5G heterogeneous networks with mesh millimeter wave backhaul links. A: IEEE International Symposium on a World of Wireless, Mobile, and Multimedia Networks. "18th IEEE International Symposium on a World of Wireless, Mobile, and Multimedia Networks (WoWMoM 2017): June 12-15, 2017, Macao Polytechnic Institute". Macau: Institute of Electrical and Electronics Engineers (IEEE), 2017, p. 1-6.
ISBN978-1-5386-2722-8
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