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dc.contributor.authorHutchinson, John M.
dc.contributor.authorRomán Concha, Frida Rosario
dc.contributor.authorCortés Izquierdo, María Pilar
dc.contributor.authorCalventus Solé, Yolanda
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Màquines i Motors Tèrmics
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Química
dc.date.accessioned2018-02-02T13:34:30Z
dc.date.issued2017-03-03
dc.identifier.citationHutchinson, J.M., Roman, F., Cortes, M., Calventus, Y. Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity. "Polimery", 3 Març 2017, vol. 62, núm. 7-8, p. 560-566.
dc.identifier.issn0032-2725
dc.identifier.urihttp://hdl.handle.net/2117/113634
dc.description.abstractEpoxy composites containing boron nitride (BN) or aluminum nitride (AlN or Al2N3) particles have been studied with a view to obtaining increased thermal conductivity. The effect of these fillers on the cure reaction has been investigated by differential scanning calorimetry (DSC) for two systems, epoxy-diamine and epoxy-thiol, and for volume fractions up to about 35 % of these filler particles. For the epoxy-diamine system, the glass transition temperature of the fully cured system, the heat of reaction, and the temperature at which the peak heat flow occurs were all independent of the cure conditions, filler type and content. In contrast, the epoxy-thiol system shows a systematic effect of filler on the peak temperature for both fillers: there is an initial acceleration of the reaction, which diminishes with increasing content, and the reaction is even significantly retarded at high contents for BN. This is interpreted in terms of an improved interface between epoxy matrix and particles, with a consequent enhancement of the thermal conductivity of the epoxy-thiol composites.
dc.format.extent7 p.
dc.language.isoeng
dc.subjectÀrees temàtiques de la UPC::Enginyeria química
dc.subject.lcshEpoxy compounds
dc.subject.lcshThermal conductivity
dc.subject.lcshCalorimetry
dc.subject.otherEpoxy composites
dc.subject.otherBoron nitride
dc.subject.otherAluminum nitride
dc.subject.otherThermal conductivity
dc.subject.otherDifferential scanning calorimetry
dc.titleEpoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity
dc.typeArticle
dc.subject.lemacEpòxids
dc.subject.lemacCalorimetria
dc.contributor.groupUniversitat Politècnica de Catalunya. POLTEPO - Polímers Termoestables Epoxídics
dc.identifier.doi10.14314/polimery.2017.560
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://en.www.ichp.pl/Epoxy-composites-filled-with-boron-nitride
dc.rights.accessRestricted access - publisher's policy
local.identifier.drac21690982
dc.description.versionPostprint (published version)
dc.relation.projectidinfo:eu-repo/grantAgreement/MINECO/1PE/MAT2014-53706-C3-3-R
dc.date.lift10000-01-01
local.citation.authorHutchinson, J.M.; Roman, F.; Cortes, M.; Calventus, Y.
local.citation.publicationNamePolimery
local.citation.volume62
local.citation.number7-8
local.citation.startingPage560
local.citation.endingPage566


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