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dc.contributor.authorMuguruza Blanco, Asier
dc.contributor.authorBonada Bo, Jordi
dc.contributor.authorGómez, Agustin
dc.contributor.authorMinguella Canela, Joaquim
dc.contributor.authorFernandes, Joana
dc.contributor.authorRamos, Francisco
dc.contributor.authorXuriguera Martin, Elena
dc.contributor.authorVarea Espelt, Aida
dc.contributor.authorCirera Hernandez, Albert
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament de Resistència de Materials i Estructures a l'Enginyeria
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Mecànica
dc.date.accessioned2017-10-11T07:05:19Z
dc.date.available2017-10-11T07:05:19Z
dc.date.issued2017-10-06
dc.identifier.citationMuguruza, A., Bonada, J., Gómez, A., Minguella-Canela, J., Fernandes, J., Ramos, F., Xuriguera, E., Varea Espelt, A., Cirera , A. Development of a multi-material additive manufacturing process for electronic devices. "Procedia Manufacturing", 6 Octubre 2017, vol. 13, p. 746-753.
dc.identifier.issn2351-9789
dc.identifier.urihttp://hdl.handle.net/2117/108630
dc.description.abstractIn order to increas e the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two -dimensional Drop- on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer -by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit em bedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co- firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for a chieving functional parts are discussed and a few prototypes have been built in order to validate this technology
dc.format.extent8 p.
dc.language.isoeng
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subjectÀrees temàtiques de la UPC::Enginyeria mecànica
dc.subject.lcshThree-dimensional printing.
dc.subject.lcshMaterials--Technological innovations
dc.subject.otherAdditive Manufacturing
dc.subject.otherMultimaterial
dc.subject.otherPrinting Electronics.
dc.titleDevelopment of a multi-material additive manufacturing process for electronic devices
dc.typeArticle
dc.subject.lemacImpressió 3D
dc.subject.lemacFabricació -- Automatització
dc.subject.lemacMaterials -- Innovacions tecnològiques
dc.contributor.groupUniversitat Politècnica de Catalunya. REMM - Recerca en Estructures i Mecànica de Materials
dc.contributor.groupUniversitat Politècnica de Catalunya. TECNOFAB - Grup de Recerca en Tecnologies de Fabricació
dc.description.peerreviewedPeer Reviewed
dc.rights.accessOpen Access
local.identifier.drac21566807
dc.description.versionPostprint (author's final draft)
local.citation.authorMuguruza, A.; Bonada, J.; Gómez, A.; Minguella-Canela, J.; Fernandes, J.; Ramos, F.; Xuriguera, E.; Varea Espelt, A.; Cirera, A.
local.citation.publicationNameProcedia Manufacturing
local.citation.volume13
local.citation.startingPage746
local.citation.endingPage753


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Attribution-NonCommercial-NoDerivs 3.0 Spain
Except where otherwise noted, content on this work is licensed under a Creative Commons license : Attribution-NonCommercial-NoDerivs 3.0 Spain