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dc.contributor.authorPerpiñà Gilabet, Xavier
dc.contributor.authorLeón, Javier
dc.contributor.authorAltet Sanahujes, Josep
dc.contributor.authorVellvehi, Miquel
dc.contributor.authorReverter Cubarsí, Ferran
dc.contributor.authorBarajas Ojeda, Enrique
dc.contributor.authorJordà, Xavier
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.date.accessioned2017-03-20T10:50:15Z
dc.date.available2018-02-27T01:30:42Z
dc.date.issued2017-02-27
dc.identifier.citationPerpiñà, X., León, J., Altet, J., Vellvehi, M., Reverter, F., Barajas, E., Jordà, X. Thermal phase lag heterodyne infrared imaging for current tracking in radio frequency integrated circuits. "Applied physics letters", 27 Febrer 2017, vol. 110, núm. 094101, p. 1-5.
dc.identifier.issn0003-6951
dc.identifier.urihttp://hdl.handle.net/2117/102649
dc.description.abstractWith thermal phase lag measurements, current paths are tracked in a Class A radio frequency (RF) power amplifier at 2 GHz. The amplifier is heterodynally driven at 440 MHz and 2 GHz, and its resulting thermal field was inspected, respectively, at 1013 and 113 Hz with an infrared lock-in thermography system. The phase lag maps evidence with a higher sensitivity than thermal amplitude measurements an input-output loop due to a substrate capacitive coupling. This limits the amplifier’s performance, raising the power consumption in certain components. Other information relative to local power consumption and amplifier operation is also inferred. This approach allows the local non-invasive testing of integrated systems regardless of their operating frequency.
dc.format.extent5 p.
dc.language.isoeng
dc.subjectÀrees temàtiques de la UPC::Enginyeria electrònica::Circuits electrònics
dc.subject.lcshIntegrated circuits
dc.subject.lcshRadio frequency
dc.subject.otherAmplifiers
dc.subject.otherHeterodyne detectors
dc.subject.otherRadiofrequency power transmission
dc.subject.otherMOSFETs
dc.subject.otherEnergy use
dc.titleThermal phase lag heterodyne infrared imaging for current tracking in radio frequency integrated circuits
dc.typeArticle
dc.subject.lemacCircuits integrats
dc.subject.lemacRadiofreqüència
dc.contributor.groupUniversitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
dc.contributor.groupUniversitat Politècnica de Catalunya. e-CAT - Circuits i Transductors Electrònics
dc.identifier.doi10.1063/1.4977175
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://aip.scitation.org/doi/abs/10.1063/1.4977175
dc.rights.accessOpen Access
local.identifier.drac19783681
dc.description.versionPostprint (author's final draft)
local.citation.authorPerpiñà, X.; León, J.; Altet, J.; Vellvehi, M.; Reverter, F.; Barajas, E.; Jordà, X.
local.citation.publicationNameApplied physics letters
local.citation.volume110
local.citation.number094101
local.citation.startingPage1
local.citation.endingPage5


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