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dc.contributor.authorChaparro, Pedro
dc.contributor.authorGonzález González, José
dc.contributor.authorGonzález Colás, Antonio María
dc.contributor.otherUniversitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
dc.date.accessioned2017-02-23T08:35:10Z
dc.date.available2017-02-23T08:35:10Z
dc.date.issued2004
dc.identifier.citationChaparro, P., González, J., González, A. Thermal-aware clustered microarchitectures. A: IEEE International Conference on Computer Design: VLSI in Computers and Processors. "IEEE International Conference on Computer Design: VLSI in Computers and Processors, 2004, ICCD 2004: proceedings". San Jose, CA: Institute of Electrical and Electronics Engineers (IEEE), 2004, p. 48-53.
dc.identifier.isbn0-7695-2231-9
dc.identifier.urihttp://hdl.handle.net/2117/101429
dc.description.abstractAs frequencies and feature size scale faster than operating voltages, power density is increasing in each processor generation. Power density and the cost of removing the heat it generates are increasing at the same rate. Leakage is significantly increasing every process generation and it is expected to be the main source of power in the near future. Moreover, leakage power grows exponentially with temperature. This paper proposes and evaluates several techniques with two goals: reduction of average temperature in order to decrease leakage power, and reduction of peak temperature in order to reduce cooling cost. Combinations of temperature-aware steering techniques and cluster hopping are investigated in a quad-cluster superscalar microarchitecture. Combining cluster hopping with a temperature-aware steering policy results in 30% reduction in leakage power and 8% reduction in average peak temperature at the expense of a slowdown of just 5%.
dc.format.extent6 p.
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.subjectÀrees temàtiques de la UPC::Informàtica::Arquitectura de computadors
dc.subject.lcshMicroprocessors -- Energy consumption
dc.subject.otherCost reduction
dc.subject.otherMicroprocessor chips
dc.subject.otherComputer architecture
dc.subject.otherThermal management (packaging)
dc.titleThermal-aware clustered microarchitectures
dc.typeConference report
dc.subject.lemacMicroprocessadors -- Consum d'energia
dc.contributor.groupUniversitat Politècnica de Catalunya. ARCO - Microarquitectura i Compiladors
dc.identifier.doi10.1109/ICCD.2004.1347897
dc.description.peerreviewedPeer Reviewed
dc.relation.publisherversionhttp://ieeexplore.ieee.org/document/1347897/
dc.rights.accessOpen Access
local.identifier.drac2453907
dc.description.versionPostprint (published version)
local.citation.authorChaparro, P.; González, J.; González, A.
local.citation.contributorIEEE International Conference on Computer Design: VLSI in Computers and Processors
local.citation.pubplaceSan Jose, CA
local.citation.publicationNameIEEE International Conference on Computer Design: VLSI in Computers and Processors, 2004, ICCD 2004: proceedings
local.citation.startingPage48
local.citation.endingPage53


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