Microstructure and properties of copper deformed by accumulative roll-bonding

Abstract

Accumulative Roll Bonding (ARB), which is a process of severe plastic deformation (SPD), was applied to commercially pure copper 99, 97 % by performing up to 7 ARB cycles at room temperature (RT) conditions without lubrication, at cryogenic temperature (CT) conditions, and high temperature (HT) conditions, respectively. Microstructural characterizations were performed by optical microscopy (OM) and scanning electron microscopy (SEM). Observations revealed that refined grains were produce in Cu after ARB and, the continuous recrystallization microstructure was observed. Vickers hardness (VH) measurements were performed on the deformed samples, showing a gradual increase of hardness showing a gradual increasing of hardness with increasing strain/decreasing grain size at first, but then a decrease of hardness with further increasing strain.